A process for manufacturing electrochromic layers/devices at high rates and low deposition temperatures is described. The method utilizes the magnetron enhanced sputtering technique in which a substrate (36) is rotated past sputter cathodes (38, 40, 42, 44, 46) and past a reactive ion source (48) in order to deposit a layered electrochromic device. The process uses high system pressure and large reaction gas flow rates, but relatively low reactive gas partial pressures at the sputter cathodes (38, 40, 42, 44, 46) to reproducibly form electrochromic materials and devices which exhibit excellent optical and physical properties.