发明公开
EP0791981A2 High-density electrical interconnect system
失效
Elektrische Verbindungsanordnung mit hoher Packungsdichte
- 专利标题： High-density electrical interconnect system
- 专利标题（中）： Elektrische Verbindungsanordnung mit hoher Packungsdichte
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申请号： EP97105375.6申请日： 1993-11-18
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公开(公告)号： EP0791981A2公开(公告)日： 1997-08-27
- 发明人: CRANE, Stanford W., Jr.
- 申请人： CRANE, Stanford W., Jr.
- 申请人地址： 3934 Northwest 57th Street Boca Raton, FL 33496 US
- 专利权人： CRANE, Stanford W., Jr.
- 当前专利权人： CRANE, Stanford W., Jr.
- 当前专利权人地址： 3934 Northwest 57th Street Boca Raton, FL 33496 US
- 代理机构： Hug Interlizenz AG
- 优先权： US983083 19921201
- 主分类号： H01R9/09
- IPC分类号： H01R9/09
摘要：
An electrical interconnect system includes an insulative substrate (503), and a plurality of groups (514) of electrically conductive contacts (500) arranged on the substrate (503). The contacts (500) are electrically isolated from one another, and the groups (514) are interleaved among one another in a nested configuration. The system also includes a plurality of receiving-type interconnect components (900) each for receiving one of the groups (514) of contacts (500) within that component. The nested configuration of the groups (514) of contacts (500) maintains the contacts in close proximity to one another and, at the same time, allows adequate clearance between the contacts (500) so that each group (514) may be received within one of the receiving-type interconnect components (900).
公开/授权文献
- EP0791981B1 High-density electrical interconnect system 公开/授权日：2002-10-02
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