High-density electrical interconnect system
    2.
    发明公开
    High-density electrical interconnect system 失效
    Elektrische Verbindungsanordnung mit hoher Packungsdichte

    公开(公告)号:EP0791981A2

    公开(公告)日:1997-08-27

    申请号:EP97105375.6

    申请日:1993-11-18

    IPC分类号: H01R9/09

    摘要: An electrical interconnect system includes an insulative substrate (503), and a plurality of groups (514) of electrically conductive contacts (500) arranged on the substrate (503). The contacts (500) are electrically isolated from one another, and the groups (514) are interleaved among one another in a nested configuration. The system also includes a plurality of receiving-type interconnect components (900) each for receiving one of the groups (514) of contacts (500) within that component. The nested configuration of the groups (514) of contacts (500) maintains the contacts in close proximity to one another and, at the same time, allows adequate clearance between the contacts (500) so that each group (514) may be received within one of the receiving-type interconnect components (900).

    摘要翻译: 电互连系统包括绝缘衬底(503)和布置在衬底(503)上的导电触点(500)的多个组(514)。 触点(500)彼此电隔离,并且组(514)在嵌套配置中彼此交错。 该系统还包括多个接收型互连部件(900),每个部件用于接收该部件内的触点组(514)中的一个。 触点组(514)的嵌套配置保持触点彼此靠近,并且同时允许触点(500)之间的足够的间隙,使得每个组(514)可以被接收在 一个接收型互连部件(900)。

    HIGH-DENSITY ELECTRICAL INTERCONNECT SYSTEM
    6.
    发明授权
    HIGH-DENSITY ELECTRICAL INTERCONNECT SYSTEM 失效
    用高密度封装电连接装置

    公开(公告)号:EP0672309B1

    公开(公告)日:1997-10-22

    申请号:EP94901497.1

    申请日:1993-11-18

    IPC分类号: H01R9/09

    摘要: An electrical interconnect system includes an insulative substrate (503), and a plurality of groups (514) of electrically conductive contacts (500) arranged on the substrate (503). The contacts (500) are electrically isolated from one another, and the groups (514) are interleaved among one another in a nested configuration. The system also includes a plurality of receiving-type interconnect components (900) each for receiving one of the groups (514) of contacts (500) within that component. The nested configuration of the groups (514) of contacts (500) maintains the contacts in close proximity to one another and, at the same time, allows adequate clearance between the contacts (500) so that each group (514) may be received within one of the receiving-type interconnect components (900).

    High-density electrical interconnect system
    7.
    发明公开
    High-density electrical interconnect system 失效
    高密度电气互连系统

    公开(公告)号:EP0791981A3

    公开(公告)日:1997-09-03

    申请号:EP97105375.6

    申请日:1993-11-18

    IPC分类号: H01R9/09

    摘要: An electrical interconnect system includes an insulative substrate (503), and a plurality of groups (514) of electrically conductive contacts (500) arranged on the substrate (503). The contacts (500) are electrically isolated from one another, and the groups (514) are interleaved among one another in a nested configuration. The system also includes a plurality of receiving-type interconnect components (900) each for receiving one of the groups (514) of contacts (500) within that component. The nested configuration of the groups (514) of contacts (500) maintains the contacts in close proximity to one another and, at the same time, allows adequate clearance between the contacts (500) so that each group (514) may be received within one of the receiving-type interconnect components (900).

    摘要翻译: 电互连系统包括绝缘衬底(503)和布置在衬底(503)上的多个导电触点(500)组(514)。 触点(500)彼此电隔离,并且组(514)以嵌套配置彼此交错。 该系统还包括多个接收型互连部件(900),每个接收型互连部件(900)用于接收该部件内的接触件(500)的组(514)中的一个。 接触件(500)的组(514)的嵌套配置使接触件彼此紧密靠近并且同时允许接触件(500)之间具有足够的间隙,使得每个组件(514)可以被接收在 接收型互连组件(900)中的一个。