发明公开
- 专利标题： Semiconductor module
- 专利标题（中）： Halbleitermodul
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申请号： EP97122703.8申请日： 1992-09-17
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公开(公告)号： EP0838855A2公开(公告)日： 1998-04-29
- 发明人: Mori, Mutsuhiro , Saito, Ryuichi , Kimura, Shin , Nakata, Kiyoshi , Saitoo, Syuuji , Horie, Akira , Koike, Yoshihiko , Sekine, Shigeki
- 申请人： Hitachi, Ltd.
- 申请人地址： 6, Kanda Surugadai 4-chome Chiyoda-ku, Tokyo 101-0062 JP
- 专利权人： Hitachi, Ltd.
- 当前专利权人： Hitachi, Ltd.
- 当前专利权人地址： 6, Kanda Surugadai 4-chome Chiyoda-ku, Tokyo 101-0062 JP
- 代理机构： Beetz & Partner Patentanwälte
- 优先权： JP241681/91 19910920; JP13684/92 19920129
- 主分类号： H01L25/065
- IPC分类号： H01L25/065 ; H02M7/48
摘要：
A semiconductor module comprising a plurality of switching device chips (35) disposed on a metal substrate (30) are provided with main electrodes (35C, 35E) on the main surfaces of the chips (35) and a control electrode (35G); at least one diode chip (36) disposed on the metal substrate (30) is provided with main electrodes (36A, 35K) on the main surface of said chip (36); an electrode plate (31) disposed on the metal substrate (30) through an insulation plate (32a) and connected with a plurality of conductive portions of the other main electrodes of the switching device chip (35) and the diode chip (36); first and second lead terminals for connecting the one main electrode (35C) of the switching device chip (35) with the one main electrode (36A) of the diode chip (36), and a resin case (103) for covering the module, wherein the first and second lead terminals are brought out to an outside of the resin case.
公开/授权文献
- EP0838855B1 Semiconductor module 公开/授权日：2004-11-24
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