发明公开
EP0845792A2 Wire wound electronic component and method of manufacturing the same
失效
Drahtgewickeltes elektronisches Bauelement und Verfahren zu seiner Herstellung
- 专利标题： Wire wound electronic component and method of manufacturing the same
- 专利标题（中）： Drahtgewickeltes elektronisches Bauelement und Verfahren zu seiner Herstellung
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申请号： EP97309130.9申请日： 1997-11-13
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公开(公告)号： EP0845792A2公开(公告)日： 1998-06-03
- 发明人: Amada, Yoshihiro , Aoba, Hideo , Otsuka, Kazuhiko , Umeyama, Nobuhiro , Koizumi, Katsuo , Mamada, Nobuo , Fujikawa, Iwao , Shiba, Nobuyasu , Uehara, Takayuki
- 申请人： TAIYO YUDEN CO., LTD.
- 申请人地址： 16-20, Ueno 6-chome Taito-ku Tokyo 110 JP
- 专利权人： TAIYO YUDEN CO., LTD.
- 当前专利权人： TAIYO YUDEN CO., LTD.
- 当前专利权人地址： 16-20, Ueno 6-chome Taito-ku Tokyo 110 JP
- 代理机构： Beresford, Keith Denis Lewis
- 优先权： JP334973/96 19961129; JP334825/96 19961130; JP352817/96 19961214
- 主分类号： H01F17/04
- IPC分类号： H01F17/04 ; H01F27/29 ; H01F41/04
摘要：
A wire wound electronic component of the present invention includes a bobbin having a core 1a having a substantially circular cross-section and rectangular flanges 1b formed at both ends of the core. A groove 2 is formed in each side of each flange 1b. A conductive film or external electrode 3 is formed on each flange 1b. A coil or wire 4 is wound round the core la and has a conductor protruding from opposite stripped ends thereof. The opposite ends 5 of the conductor are respectively received in the grooves 2 of the flanges 1b and connected to the conductive films 3. A coating or armor 6 is formed on the coil 4 and has a flat surface 6a. The coating 6 has a rectangular configuration complementary to the configuration of the flanges 1b.
公开/授权文献
- EP0845792B1 Method of manufacturing a wire wound electronic component 公开/授权日：2004-02-11
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