Wire wound electronic component and method of manufacturing the same
    3.
    发明公开
    Wire wound electronic component and method of manufacturing the same 失效
    Drahtgewickeltes elektronisches Bauelement und Verfahren zu seiner Herstellung

    公开(公告)号:EP0845792A2

    公开(公告)日:1998-06-03

    申请号:EP97309130.9

    申请日:1997-11-13

    IPC分类号: H01F17/04 H01F27/29 H01F41/04

    摘要: A wire wound electronic component of the present invention includes a bobbin having a core 1a having a substantially circular cross-section and rectangular flanges 1b formed at both ends of the core. A groove 2 is formed in each side of each flange 1b. A conductive film or external electrode 3 is formed on each flange 1b. A coil or wire 4 is wound round the core la and has a conductor protruding from opposite stripped ends thereof. The opposite ends 5 of the conductor are respectively received in the grooves 2 of the flanges 1b and connected to the conductive films 3. A coating or armor 6 is formed on the coil 4 and has a flat surface 6a. The coating 6 has a rectangular configuration complementary to the configuration of the flanges 1b.

    摘要翻译: 本发明的绕线电子元件包括具有大致圆形横截面的芯1a和形成在芯的两端的矩形凸缘1b的线轴。 在每个凸缘1b的每一侧形成有槽2。 在每个凸缘1b上形成导电膜或外部电极3。 线圈或线4围绕芯1a缠绕并且具有从相对的剥离端突出的导体。 导体的相对端5分别容纳在凸缘1b的槽2中并连接到导电膜3.在线圈4上形成涂层或装甲6,并具有平坦表面6a。 涂层6具有与凸缘1b的构造互补的矩形构造。