发明公开
EP0847076A2 Manufacturing semiconductor devices 失效
Herstellung von Halbleiteranordnungen

Manufacturing semiconductor devices
摘要:
A very compact silicon fabrication line has a number of process cells 20 to 25 all contained within a common outer enclosure 1. A semiconductor wafer 70 is loaded into the enclosure 1 through an air lock 10 and is mounted on a cap 56 supported under a carriage 80 movable along a rail 90 extending along the enclosure 1 between the different process cells 20 to 25. The cap 56 is lowered into sealing engagement with the open top 53, 54 of a cell 20 to 25 during each process.
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