发明公开
EP0881868A3 Socket for mounting package and mount structure of package using the same
失效
对于电路版本及其电路的安装结构中的应用
- 专利标题： Socket for mounting package and mount structure of package using the same
- 专利标题（中）： 对于电路版本及其电路的安装结构中的应用
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申请号： EP97122435.7申请日： 1997-12-18
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公开(公告)号： EP0881868A3公开(公告)日： 2000-01-12
- 发明人: Hanada, Koji , Uzuka, Yoshinori , Tamura, Akira , Nishiyama, Takeshi
- 申请人： FUJITSU LIMITED
- 申请人地址： 1-1, Kamikodanaka 4-chome, Nakahara-ku Kawasaki-shi, Kanagawa 211-8588 JP
- 专利权人： FUJITSU LIMITED
- 当前专利权人： FUJITSU LIMITED
- 当前专利权人地址： 1-1, Kamikodanaka 4-chome, Nakahara-ku Kawasaki-shi, Kanagawa 211-8588 JP
- 代理机构： Schmidt-Evers, Jürgen, Dipl.-Ing.
- 优先权： JP14044697 19970529
- 主分类号： H05K7/10
- IPC分类号： H05K7/10
摘要：
A socket (30, 30A, 30B, 30C) for mounting a package (50, 50A) has a socket body (31) on which the package (50, 50A) is mounted and a plurality of contacts (33) which are integrated in the socket body. The socket (30, 30A, 30B, 30C) has a flexural rigidity (M 1 ) which is smaller than a flexural rigidity (M 2 ) of a substrate (70) on which the socket (30, 30A, 30B, 30C) is to be mounted.
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