发明公开
- 专利标题: Semiconductor device
- 专利标题(中): Halbleiteranordnung
-
申请号: EP99202202.0申请日: 1993-10-21
-
公开(公告)号: EP0952611A2公开(公告)日: 1999-10-27
- 发明人: Takahashi, Kunihiro , Suzuki, Mizuaki , Yamazaki, Tsuneo , Takasu, Hiroaki , Nakajima, Kunio , Sakurai, Atsushi , Iwaki, Tadao , Kojima, Yoshikazu , Kamiya, Masaaki
- 申请人: Seiko Instruments Inc.
- 申请人地址: 8 Nakase 1-chome, Mihama-ku Chiba-shi, Chiba 261-8507 JP
- 专利权人: Seiko Instruments Inc.
- 当前专利权人: Seiko Instruments Inc.
- 当前专利权人地址: 8 Nakase 1-chome, Mihama-ku Chiba-shi, Chiba 261-8507 JP
- 代理机构: Sturt, Clifford Mark
- 优先权: JP28309192 19921021; JP3360193 19930223; JP5247793 19930312; JP16295793 19930630; JP18048493 19930721; JP22262793 19930907
- 主分类号: H01L23/36
- IPC分类号: H01L23/36 ; H01L27/12 ; G02F1/136
摘要:
A semiconductor substrate and a light-valve semiconductor substrate is provided so as to prevent the threshold value of a MOS transistor on a single-crystal silicon device forming layer from increasing in order to obtain a MOS integrated circuit with a high reliability even for over a long time of operation. A semiconductor substrate and a light-valve semiconductor substrate comprising a single-crystal silicon thin-film device forming layer 5001 formed above an insulating substrate 5004 through an adhesive layer 5003 and an insulating layer 5002 formed on the single-crystal silicon thin-film device forming layer, wherein heat conductive layers 5201 and 5202 made of a material with a high heat conductivity are arranged between the single-crystal silicon thin-film device forming layer and the adhesive layer and on the insulating layer.
公开/授权文献
- EP0952611A3 Semiconductor device 公开/授权日:2000-06-28
信息查询
IPC分类: