发明公开
- 专利标题： HOT MELT ADHESIVE COMPOSITIONS
- 专利标题（中）： HEISSSCHMELZKLEBSTOFFZUSAMMENSETZUNGEN
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申请号： EP98900677.0申请日： 1998-01-21
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公开(公告)号： EP0957147A1公开(公告)日： 1999-11-17
- 发明人: MORIZONO, Kenichi, Mitsui Chemicals, Inc. , OKADA, Keiji, Mitsui Chemicals, Inc. , TOKITA, Suguru, Mitsui Chemicals, Inc.
- 申请人： Mitsui Chemicals, Inc.
- 申请人地址： 2-5, Kasumigaseki 3-chome, Chiyoda-ku Tokyo 100 JP
- 专利权人： Mitsui Chemicals, Inc.
- 当前专利权人： Mitsui Chemicals, Inc.
- 当前专利权人地址： 2-5, Kasumigaseki 3-chome, Chiyoda-ku Tokyo 100 JP
- 代理机构： Cresswell, Thomas Anthony
- 优先权： JP1711097 19970130
- 国际公布： WO9833861 19980806
- 主分类号： C09J123/00
- IPC分类号： C09J123/00 ; C09J201/00 ; C09J109/06 ; C09J153/02 ; C09J125/00
摘要：
A hot-melt adhesive composition comprises 100 parts by weight of a tackifier (B), and 1 to 900 parts by weight of an α-olefin/aromatic vinyl compound random copolymer (C). A hot-melt adhesive composition comprises 100 parts by weight of a base polymer (A), 1 to 900 parts by weight of component (B), and 1 to 1,000 parts by weight of component (C). A hot-melt adhesive composition comprises 100 parts by weight of component (A), 10 to 300 parts by weight of component (B), and 10 to 400 parts by weight of component (C). The component (A) is preferably at least one polymer selected from the group consisting of a polyolefin (a-1), a polar group containing polymer (a-2) and an aromatic vinyl compound/conjugated diene copolymer (a-3).
These hot-melt adhesive compositions exhibit excellent adhesive strength and can be used as an adhesive for styrene resins.
These hot-melt adhesive compositions exhibit excellent adhesive strength and can be used as an adhesive for styrene resins.
公开/授权文献
- EP0957147B1 HOT MELT ADHESIVE COMPOSITIONS 公开/授权日：2004-03-31
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