This invention is to provide a processing system suitable for manufacturing an SOI substrate. The processing system (6000) includes an inverting apparatus (6130), centering apparatus (6120), cleaning/drying apparatus (6110), loader (6070), first unloader (6080), second unloader (6090), third unloader (6100), and separating apparatus (6020). The processing system (6000) also has a conveyor mechanism which linearly moves a robot hand (6152) along a horizontal driving shaft (6160) in a horizontal plane and pivots the robot hand about a pivot shaft (6151), and moves the robot hand (6152) close to or away from the pivot shaft (6151) to convey a bonded substrate stack (50) or separated substrate among the plurality of processing apparatuses. The plurality of processing apparatuses are disposed at positions where the conveyor mechanism can transfer a bonded substrate stack or separated substrate.