公开(公告)号：EP0851513B1

公开(公告)日：2007-11-21

申请号：EP97122777.2

申请日：1997-12-23

申请人： CANON KABUSHIKI KAISHA

发明人： Katsumi, Nakagawa ,  Takao, Yonehara ,  Shoji, Nishida ,  Sakaguchi, Kiyofumi

IPC分类号： H01L31/18 ,  H01L21/20

CPC分类号： H01L21/02032 ,  C30B19/12 ,  H01L21/02381 ,  H01L21/02513 ,  H01L21/02532 ,  H01L21/0262 ,  H01L21/02625 ,  H01L21/02628 ,  H01L21/02664 ,  H01L21/2007 ,  H01L21/3063 ,  H01L21/76251 ,  H01L29/66772 ,  H01L29/78654 ,  H01L31/068 ,  H01L31/0687 ,  H01L31/1804 ,  H01L33/0062 ,  H01L2221/68368 ,  Y02E10/544 ,  Y02E10/547 ,  Y02P70/521 ,  Y10S438/977

公开(公告)号：EP0938129B1

公开(公告)日：2006-03-29

申请号：EP99301181.6

申请日：1999-02-17

申请人： CANON KABUSHIKI KAISHA

发明人： Ohmi, Kazuaki ,  Yanagita, Kazutaka ,  Sakaguchi, Kiyofumi

IPC分类号： H01L21/20 ,  H01L21/762

CPC分类号： H01L21/76254 ,  H01L21/76251 ,  H01L21/76259

公开(公告)号：EP0938132B1

公开(公告)日：2005-04-13

申请号：EP98310437.3

申请日：1998-12-18

申请人： CANON KABUSHIKI KAISHA

发明人： Sakaguchi, Kiyofumi ,  Yanagita, Kazutaka

IPC分类号： H01L21/306 ,  C23F1/00 ,  H01L21/762

CPC分类号： H01L21/76251 ,  H01L21/30604 ,  H01L21/76259

公开(公告)号：EP0999577A3

公开(公告)日：2005-02-23

申请号：EP99308784.0

申请日：1999-11-04

申请人： CANON KABUSHIKI KAISHA

发明人： Yanagita, Kazutaka ,  Ohmi, Kazuaki ,  Sakaguchi, Kiyofumi

IPC分类号： H01L21/00 ,  H01L21/68 ,  B25J9/04 ,  B32B35/00 ,  B26D5/12

CPC分类号： H01L21/67173 ,  H01L21/67092 ,  H01L21/67745

摘要： This invention is to provide a processing system suitable for manufacturing an SOI substrate. The processing system (6000) includes an inverting apparatus (6130), centering apparatus (6120), cleaning/drying apparatus (6110), loader (6070), first unloader (6080), second unloader (6090), third unloader (6100), and separating apparatus (6020). The processing system (6000) also has a conveyor mechanism which linearly moves a robot hand (6152) along a horizontal driving shaft (6160) in a horizontal plane and pivots the robot hand about a pivot shaft (6151), and moves the robot hand (6152) close to or away from the pivot shaft (6151) to convey a bonded substrate stack (50) or separated substrate among the plurality of processing apparatuses. The plurality of processing apparatuses are disposed at positions where the conveyor mechanism can transfer a bonded substrate stack or separated substrate.

公开(公告)号：EP1229581A3

公开(公告)日：2005-01-12

申请号：EP02002258.8

申请日：2002-01-30

申请人： CANON KABUSHIKI KAISHA

发明人： Sakaguchi, Kiyofumi ,  Yonehara, Takao

IPC分类号： H01L21/78

CPC分类号： H01L21/304 ,  H01L21/02203 ,  H01L21/02238 ,  H01L21/02255 ,  H01L21/02307 ,  H01L21/02337 ,  H01L21/306 ,  H01L21/3063 ,  H01L21/31675 ,  H01L21/78 ,  H01L2221/68363 ,  H01L2224/48091 ,  H01L2924/01067 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/00014 ,  H01L2924/00

摘要： This invention provides a method of manufacturing a thin-film semiconductor device by a smaller number of processes with reduced influence on a device formation layer at the time of separation. This manufacturing method includes the step of preparing a member having, on a separation layer, a semiconductor film having a semiconductor element and/or semiconductor integrated circuit, the step of forming kerfs from the semiconductor film side of the member, and the separation step of, after the kerf formation step, separating a desired region of the semiconductor element and/or semiconductor integrated circuit from the member.

摘要翻译： 本发明提供了一种通过在分离时对器件形成层的影响减小的较少数量的工艺来制造薄膜半导体器件的方法。 该制造方法包括以下步骤：制备在分离层上具有半导体元件和/或半导体集成电路的半导体膜的部件，从部件的半导体膜侧形成切口的步骤，以及分离步骤 在切口形成步骤之后，将半导体元件和/或半导体集成电路的期望区域与元件分离。

公开(公告)号：EP0999575A3

公开(公告)日：2004-08-25

申请号：EP99308761.8

申请日：1999-11-04

申请人： CANON KABUSHIKI KAISHA

发明人： Yanagita, Kazutaka ,  Ohmi, Kazuaki ,  Sakaguchi, Kiyofumi

IPC分类号： H01L21/00

CPC分类号： H01L21/67092 ,  Y10T29/49821 ,  Y10T83/364 ,  Y10T156/1137 ,  Y10T156/1939

摘要： This invention is to provide a technique of separating bonded substrate stacks having porous layers at a high yield. A separating apparatus (100) has a pair of substrate holding portions (270, 280). A bonded substrate stack (50) is sandwiched from upper and lower sides and horizontally held by the substrate holding portions (270, 280) and rotated. A jet is ejected from a nozzle (260) and injected into the porous layer of the bonded substrate stack (50), thereby separating the bonded substrate stack (50) into two substrates at the porous layer. Another separating apparatus (5000) has a pair of substrate holding portions (270, 280), a nozzle (260) of rejecting a fluid to the porous layer of a bonded substrate stack (50), and an abrupt operation prevention mechanism (4000) for preventing the lower substrate holding portion (280) from abruptly moving downward but allowing it to moderately move when separating the bonded substrate stack (50).

公开(公告)号：EP0767486B1

公开(公告)日：2004-01-02

申请号：EP96307306.9

申请日：1996-10-07

申请人： CANON KABUSHIKI KAISHA

发明人： Sato, Nobuhiko ,  Yonehara, Takao ,  Sakaguchi, Kiyofumi

IPC分类号： H01L21/20 ,  H01L21/304 ,  H01L21/306 ,  H01L21/265 ,  H01L33/00

CPC分类号： H01L21/02032 ,  H01L21/3221 ,  H01L21/3223 ,  H01L21/3226 ,  H01L21/76251 ,  H01L21/76254 ,  H01L21/76259 ,  H01L31/1892 ,  Y02E10/50

公开(公告)号：EP0940483A3

公开(公告)日：2003-08-13

申请号：EP99301336.6

申请日：1999-02-24

申请人： CANON KABUSHIKI KAISHA

发明人： Sakaguchi, Kiyofumi ,  Sato, Nobuhiko

IPC分类号： C25D11/32 ,  H01L21/306 ,  H01L21/762

CPC分类号： H01L21/02052 ,  C25D11/005 ,  C25D11/32 ,  C25D17/002 ,  H01L21/0203 ,  H01L21/76259

摘要： A porous layer having a multilayered structure is formed. An Si substrate (102) to be processed is anodized in a first electrolytic solution (141, 151) while being held between an anode (106) and a cathode (104) in an anodizing bath (101). The first electrolytic solution (141, 151) is exchanged with a second electrolytic solution (142, 152). The Si substrate (102) is anodized again, thereby forming a porous layer having a multilayered structure on the Si substrate (102).

公开(公告)号：EP0925887B1

公开(公告)日：2003-08-06

申请号：EP98310411.8

申请日：1998-12-18

申请人： CANON KABUSHIKI KAISHA

发明人： Omi, Kazuaki ,  Yonehara, Takao ,  Sakaguchi, Kiyofumi ,  Yanagita, Kazutaka

IPC分类号： B26F3/00 ,  H01L21/68

CPC分类号： H01L21/6835 ,  B26F3/004 ,  H01L21/67092 ,  H01L2924/30105 ,  Y10S156/941 ,  Y10T29/49821 ,  Y10T83/364 ,  Y10T156/11 ,  Y10T156/1126 ,  Y10T156/1374 ,  Y10T156/19

公开(公告)号：EP1261019A2

公开(公告)日：2002-11-27

申请号：EP02011266.0

申请日：2002-05-22

申请人： CANON KABUSHIKI KAISHA

发明人： Yanagita, Kazutaka ,  Kohda, Mitsuharu ,  Sakaguchi, Kiyofumi ,  Fujimoto, Akira

IPC分类号： H01L21/00

CPC分类号： H01L21/67092 ,  Y10T156/1374 ,  Y10T156/19 ,  Y10T156/1906

摘要： This invention is to support a plate member such as a bonded substrate stack in a horizontal state without coming into contact with one surface of the member and also to efficiently progress separation. Separation is executed while arranging a bonded substrate stack (50) generated by bonding a seed substrate (10) to a handle substrate (20) such that the seed substrate (10) remains on the lower side. At the first stage, the peripheral portion is separated while causing a first substrate support section (101) to chuck and support the central portion of the lower surface of the bonded substrate stack (50). Then, at the second stage, the central portion is separated while causing a second substrate support section (102) to support the lower peripheral portion and side of the bonded substrate stack (50).

摘要翻译： 本发明是在水平状态下支撑诸如键合衬底叠层的板构件而不与构件的一个表面接触并且还有效地进行分离。 在将通过将种子基板（10）接合到手柄基板（20）而产生的键合衬底叠层（50）使得种子基板（10）保持在下侧的同时进行分离。 在第一阶段，周边部分被分离，同时使第一基板支撑部分（101）夹持并支撑键合衬底叠片（50）的下表面的中心部分。 然后，在第二阶段，分离中心部分，同时使第二基板支撑部分（102）支撑键合衬底叠片（50）的下周边部分和侧面。