Invention Publication
- Patent Title: Formation of thin film capacitors
- Patent Title (中): 薄膜电容器的生产
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Application No.: EP99309146.1Application Date: 1999-11-17
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Publication No.: EP1005260A3Publication Date: 2004-04-07
- Inventor: Hunt, Andrew Tye , Flanagan, John Scott , Neuman, George Andrew
- Applicant: MicroCoating Technologies, Inc.
- Applicant Address: 3930 Green Industrial Way Chamblee, Georgia 30341 US
- Assignee: MicroCoating Technologies, Inc.
- Current Assignee: MicroCoating Technologies, Inc.
- Current Assignee Address: 3930 Green Industrial Way Chamblee, Georgia 30341 US
- Agency: Buckley, Guy Julian
- Priority: US198285 19981123; US283100 19990331; US414137 19991007
- Main IPC: H05K1/16
- IPC: H05K1/16 ; H01G4/10 ; H01G4/08 ; C23C16/453
Abstract:
Thin layer capacitors are formed from a first flexible metal layer (402,502), a dielectric layer (404,504) between about 0.03 and about 2 microns deposited thereon, and a second flexible metal layer (406,506) deposited on the dielectric layer (404,504). The first flexible metal layer may either be a metal foil (402), such as a copper, aluminum, or nickel foil, or a metal layer (502) deposited on a polymeric support sheet (501). Depositions of the layers is by or is facilitate by combustion chemical vapor deposition or controlled atmosphere chemical vapor deposition.
Public/Granted literature
- EP1005260A2 Formation of thin film capacitors Public/Granted day:2000-05-31
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