发明公开
- 专利标题： Tin electroplating process
- 专利标题（中）： 津恩，Elektroplattierungsverfahren
-
申请号： EP99309320.2申请日： 1999-11-23
-
公开(公告)号： EP1006217A1公开(公告)日： 2000-06-07
- 发明人: Chiu, See Hong , Zhang, Yun
- 申请人： LUCENT TECHNOLOGIES INC.
- 申请人地址： 600 Mountain Avenue Murray Hill, New Jersey 07974-0636 US
- 专利权人： LUCENT TECHNOLOGIES INC.
- 当前专利权人： LUCENT TECHNOLOGIES INC.
- 当前专利权人地址： 600 Mountain Avenue Murray Hill, New Jersey 07974-0636 US
- 代理机构： Johnston, Kenneth Graham
- 优先权： US110722P 19981203; US296574 19990422
- 主分类号： C25D3/32
- IPC分类号： C25D3/32 ; C25D3/60
摘要：
An electrolyte bath for plating tin or tin alloy onto metal substrates using a high speed plating process is described. The electrolyte bath contains a stannous alkyl sulfonate and an alkyl sulfonic acid. The bath also contains an organic compound that is the reaction product of polyalkylene glycol and phenolphthalein or derivatives of phenolphthalein.
公开/授权文献
- EP1006217B1 Tin electroplating process 公开/授权日：2001-03-07
信息查询
