A resin composition which has excellent melt flowability and is capable of injection molding and of giving a molded article excellent in all of electrical properties, heat resistance, and suitability for plating, characterized by being obtained by mixing 4 to 52 wt.% fluororesin particles having an average particle diameter of 0.01 to 300 νm with 48 to 96 wt.% specific polyetherimide. The resin composition is preferably produced by dissolving the polyetherimide in chloroform in a concentration of 10 to 500 g/L, dispersing the fluororesin particles into this solution in such an amount that the proportion of the polyetherimide to the fluororesin particles is from 15/85 to 85/15 by weight, subsequently distilling off the solvent to obtain a preliminary mixture having an average particle diameter of 0.1 to 500 νm, further adding the polyetherimide thereto, and mixing the ingredients.