发明公开
- 专利标题： Substrate treating apparatus and method of operating the same
- 专利标题（中）： 基板处理装置和操作方法
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申请号： EP00111268.9申请日： 2000-05-25
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公开(公告)号： EP1056122A3公开(公告)日： 2001-05-30
- 发明人: Shinozaki, Hiroyuki
- 申请人： EBARA CORPORATION
- 申请人地址： 11-1, Haneda Asahi-cho Ohta-ku, Tokyo JP
- 专利权人： EBARA CORPORATION
- 当前专利权人： EBARA CORPORATION
- 当前专利权人地址： 11-1, Haneda Asahi-cho Ohta-ku, Tokyo JP
- 代理机构： Wagner, Karl H., Dipl.-Ing.
- 优先权： JP14516799 19990525; JP24051899 19990826
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
A substrate treating apparatus including a substrate support mechanism for supporting a substrate 1 to be treated, a rotary impeller 4 placed to face the surface of the substrate 1 supported by the substrate support mechanism, and at least one nozzle 14 provided in an approximately central portion of the rotary impeller 4, wherein rotating the rotary impeller 4 produces a flow of gas passing through the nozzle 14 and flowing from the central portion of the rotary impeller 4 toward the outer periphery thereof, thereby drying the surface of the substrate supported in a stationary state by the substrate support mechanism.
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