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67 条记录 (耗时 0.017 秒)

    Magnetic bearing apparatus
    4.
    发明公开
    Magnetic bearing apparatus 审中-公开
    Magnetlager

    公开(公告)号：EP1176325A3

    公开(公告)日：2004-05-12

    申请号：EP01118169.0

    申请日：2001-07-26

    申请人： EBARA CORPORATION

    发明人： Shinozaki, Hiroyuki

    IPC分类号： F16C39/06

    CPC分类号： F16C32/0457 ,  F16C2360/45

    摘要： There is provided a magnetic bearing apparatus having no necessity of providing a magnetic flux sensor in the vicinity of a supporting electromagnet and no necessity of increasing the number of signal lines in a cable and capable of achieving an advantage similar to a conventional magnet flux feedback type power amplifier in a controller. The magnetic bearing apparatus for supporting a supported member by a magnetic force without contact comprises a current sensor (11) for detecting a control current output from a power amplifier (7) and a displacement sensor (10) for detecting a displacement of the supported member (1). A control current detection signal Si of the current sensor (11) and a displacement detection signal Sg of the displacement sensor (10) are supplied to an estimator (20) that estimates a magnetic flux or magnetic flux density generated between a surface of the electromagnet (4) and an electromagnetic target (3) on the supported member (1). An estimated value is fed back from the estimator (20) to the power amplifier (7) that supplies a control current i to an electromagnetic coil (6).

    摘要翻译： 提供了一种磁性轴承装置，其不需要在支撑电磁体附近提供磁通量传感器，并且不需要增加电缆中的信号线的数量，并且能够实现类似于常规磁通量反馈型的优点 功率放大器在控制器中。 用于通过磁力而不接触地支撑被支撑构件的磁轴承装置包括用于检测从功率放大器（7）输出的控制电流的电流传感器（11）和用于检测被支撑构件的位移的位移传感器（10） （1）。 电流传感器（11）的控制电流检测信号Si和位移传感器（10）的位移检测信号Sg被提供给估计器（20），估计器（20）估计在电磁体表面之间产生的磁通量或磁通密度 （4）和电磁目标（3）。 估计值从估计器（20）反馈到向电磁线圈（6）提供控制电流i的功率放大器（7）。

    Magnetic bearing apparatus of quick response
    5.
    发明公开
    Magnetic bearing apparatus of quick response 审中-公开
    具有短的响应时间的磁性轴承装置

    公开(公告)号：EP1191243A3

    公开(公告)日：2004-01-07

    申请号：EP01118168.2

    申请日：2001-07-26

    申请人： EBARA CORPORATION

    发明人： Shinozaki, Hiroyuki

    IPC分类号： F16C32/04 ,  F16C39/06

    CPC分类号： F16C32/0457 ,  F16C2360/45

    摘要： A magnetic bearing apparatus having a high speed-of-response and of a low cost is provided. The apparatus comprises a power amplifier for supplying a control current to a coil of an electromagnet of a control-type magnetic bearing and a non-linear component positioned in the rear of a stage where a control input signal S1 of the power amplifier and a current feedback signal S2 is added.

    Stage device and angle detecting device
    6.
    发明公开
    Stage device and angle detecting device 有权
    Trägerplattevorrichtung

    公开(公告)号：EP1333468A2

    公开(公告)日：2003-08-06

    申请号：EP03001225.6

    申请日：2003-01-20

    申请人： EBARA CORPORATION

    发明人： Shinozaki, Hiroyuki ,  Sobukawa, Hirosi ,  Yoshikawa, Shoji

    IPC分类号： H01L21/00

    CPC分类号： H01L21/682 ,  H01L21/68 ,  H01L21/681

    摘要： The present invention provides a stage device applicable to a semiconductor manufacturing apparatus. A stage device 10 comprises a Y-axis stage 20 and an X-axis stage 40, said Y-axis stage 20 including a fixed component 21 and a movable component 26 movable along the Y-axis, said X-axis stage 40 including a fixed component 41 and a movable component 43 movable along the X-axis, wherein the fixed component 41 of the X-axis stage 40 is disposed in the movable component 26 side of the Y-axis stage 20, the Y-axis is designed as a scanning axis, while the X-axis is designed as a stepping axis, and a non-contact sealing device is arranged between the fixed component 21 and the movable component 26 of the Y-axis stage 20.

    摘要翻译： 本发明提供一种适用于半导体制造装置的平台装置。 平台装置10包括Y轴平台20和X轴平台40，所述Y轴平台20包括可沿着Y轴移动的固定部件21和可移动部件26，所述X轴平台40包括 固定部件41和可沿着X轴移动的可动部件43，其中，X轴平台40的固定部件41设置在Y轴台20的可动部件26侧，Y轴被设计为 扫描轴，而X轴被设计为步进轴，并且非接触式密封装置设置在Y轴平台20的固定部件21和可动部件26之间。

    Thin-film deposition apparatus
    7.
    发明公开
    Thin-film deposition apparatus 失效
    设备用于生产薄的层

    公开(公告)号：EP0909836A3

    公开(公告)日：2001-06-13

    申请号：EP98113599.9

    申请日：1998-07-21

    申请人： EBARA CORPORATION

    发明人： Fukunaga, Yukio ,  Shinozaki, Hiroyuki ,  Tsukamoto, Kiwamu ,  Shibasaki, Mitsunao ,  Horie, Kuniaki ,  Ueyama, Hiroyuki ,  Murakami, Takeshi

    IPC分类号： C23C16/44 ,  C23C16/54 ,  C23C16/40

    CPC分类号： C23C16/45565 ,  C23C16/4412 ,  C23C16/4557 ,  C23C16/45591 ,  C23C16/46

    摘要： A compact thin-film deposition apparatus can promote a stable growth of a high quality thin-film product of uniform quality. It comprises a vacuum-tight deposition chamber (10) enclosing a substrate holding device (12) for holding a substrate (W). An elevator device (14) for moving the substrate holding device and a gas showering head (16) for flowing a film forming gas towards the substrate are provided. A transport opening (20) and an exhaust opening (22) are provided on a wall section (18) of the deposition chamber at a height to correspond to the transport position and the deposition position respectively. The deposition chamber is provided with a flow guiding member (44), and the flow guiding member comprises a cylindrical member (48) to surround an elevating path of the substrate holding device and a first ring member (50) to vertically divide a chamber space at a height between the exhaust opening and the transport opening.

    Substrate treating apparatus and method of operating the same
    8.
    发明公开
    Substrate treating apparatus and method of operating the same 有权
    基板处理装置和操作方法

    公开(公告)号：EP1056122A3

    公开(公告)日：2001-05-30

    申请号：EP00111268.9

    申请日：2000-05-25

    申请人： EBARA CORPORATION

    发明人： Shinozaki, Hiroyuki

    IPC分类号： H01L21/00

    CPC分类号： H01L21/6704 ,  H01L21/67034

    摘要： A substrate treating apparatus including a substrate support mechanism for supporting a substrate 1 to be treated, a rotary impeller 4 placed to face the surface of the substrate 1 supported by the substrate support mechanism, and at least one nozzle 14 provided in an approximately central portion of the rotary impeller 4, wherein rotating the rotary impeller 4 produces a flow of gas passing through the nozzle 14 and flowing from the central portion of the rotary impeller 4 toward the outer periphery thereof, thereby drying the surface of the substrate supported in a stationary state by the substrate support mechanism.

    Substrate treating apparatus and method of operating the same
    9.
    发明公开
    Substrate treating apparatus and method of operating the same 有权
    Substratbehandlungsvorrichtung und Betriebsverfahren

    公开(公告)号：EP1056122A2

    公开(公告)日：2000-11-29

    申请号：EP00111268.9

    申请日：2000-05-25

    申请人： EBARA CORPORATION

    发明人： Shinozaki, Hiroyuki

    IPC分类号： H01L21/00

    CPC分类号： H01L21/6704 ,  H01L21/67034

    摘要： A substrate treating apparatus including a substrate support mechanism for supporting a substrate 1 to be treated, a rotary impeller 4 placed to face the surface of the substrate 1 supported by the substrate support mechanism, and at least one nozzle 14 provided in an approximately central portion of the rotary impeller 4, wherein rotating the rotary impeller 4 produces a flow of gas passing through the nozzle 14 and flowing from the central portion of the rotary impeller 4 toward the outer periphery thereof, thereby drying the surface of the substrate supported in a stationary state by the substrate support mechanism.

    摘要翻译： 一种基板处理装置，包括用于支撑待处理的基板1的基板支撑机构，与基板支撑机构支撑的基板1的表面相对配置的旋转叶轮4，以及设置在大致中央部的至少一个喷嘴14 其中旋转叶轮4旋转产生通过喷嘴14并从旋转叶轮4的中心部分朝向其外周边流动的气体流，从而将支撑在静止状态的基板的表面干燥 状态由基板支撑机构。