发明公开
EP1058274A1 Composition for film formation and material for insulating film formation 有权
Beschichtungszusammensetzungfürdie Filmherstellung und Materialfürisolierenden Schichten

Composition for film formation and material for insulating film formation
摘要:
A composition for film formation which is useful as an interlayer insulating film material in the production of semiconductor devices and the like, and gives a coating film having excellent uniformity, low dielectric constant, low leakage current and excellent storage stability; and a material for insulating film formation using the composition.
The composition comprises

(A) a product of hydrolysis and condensation obtained by hydrolyzing and condensing at least one compound selected from the group consisting of

(A-1) compounds represented by the formula (1): R 1 a Si(OR 2 ) 4-a , and
(A-2) compounds represented by the formula (2): R 3 b (R 4 O) 3-b Si-(R 7 ) d -Si(OR 5 ) 3-c R 6 c ; and

(B) a compound represented by the formula (3): R 8 O(CHCH 3 CH 2 O) e R 9 .
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