发明公开
- 专利标题： SEMICONDUCTOR MANUFACTURING APPARATUS
- 专利标题（中）： VORRICHTUNG ZUM HERSTELLEN VON HALBLEITER
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申请号： EP99949372.9申请日： 1999-10-22
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公开(公告)号： EP1065709A1公开(公告)日： 2001-01-03
- 发明人: OHMI, Tadahiro , HIRAYAMA, Masaki , NITTA, Takahisa K. K. Ultraclean Tech. Res.Inst.
- 申请人： Kabushiki Kaisha Ultraclean Technology Research Institute , Ohmi, Tadahiro
- 申请人地址： 1-4, Hongo 4-chome Bunkyo-ku, Tokyo 113-0033 JP
- 专利权人： Kabushiki Kaisha Ultraclean Technology Research Institute,Ohmi, Tadahiro
- 当前专利权人： Kabushiki Kaisha Ultraclean Technology Research Institute,Ohmi, Tadahiro
- 当前专利权人地址： 1-4, Hongo 4-chome Bunkyo-ku, Tokyo 113-0033 JP
- 代理机构： Dr. Weitzel & Partner
- 优先权： JP30149298 19981022
- 国际公布： WO0024047 20000427
- 主分类号： H01L21/3065
- IPC分类号： H01L21/3065 ; H01L21/205
摘要：
The present invention relates to a semiconductor manufacturing apparatus, capable of uniform processing on the substrate, occupying a small floor area for installation, and presenting a good maintainability.
The semiconductor manufacturing apparatus of the present invention, is composed of a vacuum vessel, wherein at least one substrate stage is provided on said vacuum vessel bottom plate; a cylinder is installed surrounding said substrate stage; the gap between said cylinder and said vacuum vessel top plate or bottom plate is made variable by lifting/lowering said cylinder; at least one cylinder lifting/lowering mechanism per one said cylinder is provided, in order to separate a space inside said cylinder composing a processing chamber for processing said substrate surface from a space outside said cylinder composing a transport chamber for transferring said substrate; said transport chamber is provided with a substrate conveyer mechanism for transferring said substrate between said processing chamber and said transport chamber through said gap; said processing chamber is provided with a processing chamber gas inlet and a processing chamber gas outlet; and said transport chamber is provided with a transport chamber gas inlet and a transport chamber gas outlet.
The semiconductor manufacturing apparatus of the present invention, is composed of a vacuum vessel, wherein at least one substrate stage is provided on said vacuum vessel bottom plate; a cylinder is installed surrounding said substrate stage; the gap between said cylinder and said vacuum vessel top plate or bottom plate is made variable by lifting/lowering said cylinder; at least one cylinder lifting/lowering mechanism per one said cylinder is provided, in order to separate a space inside said cylinder composing a processing chamber for processing said substrate surface from a space outside said cylinder composing a transport chamber for transferring said substrate; said transport chamber is provided with a substrate conveyer mechanism for transferring said substrate between said processing chamber and said transport chamber through said gap; said processing chamber is provided with a processing chamber gas inlet and a processing chamber gas outlet; and said transport chamber is provided with a transport chamber gas inlet and a transport chamber gas outlet.
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