发明公开
- 专利标题： WET PROCESSING METHODS FOR THE MANUFACTURE OF ELECTRONIC COMPONENTS USING LIQUIDS OF VARYING TEMPERATURE
- 专利标题（中）： 湿法工艺用于生产电子组件在使用液体之用变温
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申请号： EP99926113申请日： 1999-06-02
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公开(公告)号： EP1082271A4公开(公告)日： 2005-02-16
- 发明人: VERHAVERBEKE STEVEN
- 申请人： MATTSON TECHNOLOGY IP INC
- 专利权人： MATTSON TECHNOLOGY IP INC
- 当前专利权人： MATTSON TECHNOLOGY IP INC
- 优先权： US8775898 1998-06-02
- 主分类号： C03C23/00
- IPC分类号： C03C23/00 ; H01L21/304 ; H01L21/306 ; B08B3/08 ; H01L21/00
摘要：
The present invention is directed to wet processing methods for the manufacture of electronic component precursors, such as semiconductor wafers used in integrated circuits. More specifically, this invention relates to methods of manufacturing electronic component precursors using liquids of varying temperature.
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