摘要:
The present invention is directed to wet processing methods for the manufacture of electronic component precursors, such as semiconductor wafers used in integrated circuits. More specifically, this invention relates to methods of manufacturing electronic component precursors using liquids of varying temperature.
摘要:
The present invention presents methods for, inter alia, cleaning and etching semiconductor wafers with a solution containing ammonium fluoride and control of the process used for preparing such a solution at its point of use.
摘要:
The present invention provides methods of wet processing electronic components having surfaces containing copper. In the methods of the present invention, copper containing electronic components are contacted with a copper oxidizing solution containing an oxidizing agent, and subsequently contacted with an etching solution. The methods of the present invention are particularly useful for cleaning copper containing components.