发明公开
EP1082883A1 APPARATUS AND METHOD FOR DRILLING MICROVIA HOLES IN ELECTRICAL CIRCUIT INTERCONNECTION PACKAGES
有权
DEVICE AND METHOD FOR微孔空穴的包装电气线路电接点穿孔
- 专利标题: APPARATUS AND METHOD FOR DRILLING MICROVIA HOLES IN ELECTRICAL CIRCUIT INTERCONNECTION PACKAGES
- 专利标题(中): DEVICE AND METHOD FOR微孔空穴的包装电气线路电接点穿孔
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申请号: EP99955387.8申请日: 1999-05-27
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公开(公告)号: EP1082883A1公开(公告)日: 2001-03-14
- 发明人: GOWER, Malcolm, Charles , RUMSBY, Philip, Thomas , THOMAS, Dafydd, Wyn
- 申请人: Exitech Limited , Excellon Automation Co.
- 申请人地址: Hanborough Park Long Hanborough,Oxford OX8 8LH GB
- 专利权人: Exitech Limited,Excellon Automation Co.
- 当前专利权人: Exitech Limited,Excellon Automation Co.
- 当前专利权人地址: Hanborough Park Long Hanborough,Oxford OX8 8LH GB
- 代理机构: Wagner, Karl H., Dipl.-Ing.
- 优先权: GB9811557 19980529
- 国际公布: WO9963793 19991209
- 主分类号: H05K3/00
- IPC分类号: H05K3/00 ; B23K26/06 ; B23K26/00
摘要:
This invention applies to the use of shaped beams of laser radiation for increasing the maximum speed of tools used to laser drill microvia holes in PCB's, PWB's and other electrical circuit packages. With an annular spatial intensity distribution, the maximum speed can be increased several fold from machines which do not incorporate such laser beam shaping. Different hole diameters on a one device can be programmed using a set of ring beam shaping elements incorporated into a single transmissive mask element whose lateral position when placed in the beam is computer-controlled.
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