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1.发明授权
公开(公告)号：EP1090537B1
公开(公告)日：2003-10-08
申请号：EP99953414.2
申请日：1999-05-27
CPC分类号： H05K3/0032 , B23K26/0624 , B23K26/389 , H05K3/0035
摘要： This invention relates to using mid-infrared high-power pulsed laser radiation sources for drilling high-quality microvia interconnection holes in printed circuit (wiring) boards and other electrical circuit packages.
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2.发明授权APPARATUS AND METHOD FOR DRILLING MICROVIA HOLES IN ELECTRICAL CIRCUIT INTERCONNECTION PACKAGES 有权DEVICE AND METHOD FOR微孔空穴的包装电气线路电接点穿孔
公开(公告)号：EP1082883B1
公开(公告)日：2002-10-16
申请号：EP99955387.8
申请日：1999-05-27
CPC分类号： B23K26/066 , B23K26/073 , B23K26/0734 , B23K26/382 , B23K26/389 , B23K26/40 , B23K2203/30 , B23K2203/42 , B23K2203/50 , H05K3/0026
摘要： This invention applies to the use of shaped beams of laser radiation for increasing the maximum speed of tools used to laser drill microvia holes in PCB's, PWB's and other electrical circuit packages. With an annular spatial intensity distribution, the maximum speed can be increased several fold from machines which do not incorporate such laser beam shaping. Different hole diameters on a one device can be programmed using a set of ring beam shaping elements incorporated into a single transmissive mask element whose lateral position when placed in the beam is computer-controlled.
摘要翻译： 本发明应用于使用激光辐射的成形波束的用于增加在印刷电路板用于激光钻孔微通孔的孔的工具的最大速度，PCB的和其它电路组件（8）。 具有环形设计的空间强度分布中，最大速度可以从机器哪个不配合寻求激光光束整形可以成倍增长。 一个在一个设备上的不同的孔直径可以利用一组并入到单个透射式掩模元件，其横向位置当在光束放置是计算机控制的环波束成形单元进行编程。
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3.发明公开APPARATUS AND METHOD FOR DRILLING MICROVIA HOLES IN ELECTRICAL CIRCUIT INTERCONNECTION PACKAGES 有权DEVICE AND METHOD FOR微孔空穴的包装电气线路电接点穿孔
公开(公告)号：EP1082883A1
公开(公告)日：2001-03-14
申请号：EP99955387.8
申请日：1999-05-27
CPC分类号： B23K26/066 , B23K26/073 , B23K26/0734 , B23K26/382 , B23K26/389 , B23K26/40 , B23K2203/30 , B23K2203/42 , B23K2203/50 , H05K3/0026
摘要： This invention applies to the use of shaped beams of laser radiation for increasing the maximum speed of tools used to laser drill microvia holes in PCB's, PWB's and other electrical circuit packages. With an annular spatial intensity distribution, the maximum speed can be increased several fold from machines which do not incorporate such laser beam shaping. Different hole diameters on a one device can be programmed using a set of ring beam shaping elements incorporated into a single transmissive mask element whose lateral position when placed in the beam is computer-controlled.
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4.发明公开METHOD AND APPARATUS FOR DRILLING MICROVIA HOLES IN ELECTRICAL CIRCUIT INTERCONNECTION PACKAGES 有权VERFAHREN UND VORRICHTUNG ZUM BOHREN VONMIKROSACKLÖCHERN在ELEKTRISCHEN SCHALTUNGSPACKUNGEN
公开(公告)号：EP1090537A1
公开(公告)日：2001-04-11
申请号：EP99953414.2
申请日：1999-05-27
申请人： Exitech Limited
CPC分类号： H05K3/0032 , B23K26/0624 , B23K26/389 , H05K3/0035
摘要： This invention relates to using mid-infrared high-power pulsed laser radiation sources for drilling high-quality microvia interconnection holes in printed circuit (wiring) boards and other electrical circuit packages.
摘要翻译： 本发明涉及使用中红外高功率脉冲激光辐射源，用于在印刷电路（布线）板和其它电路封装中钻出高质量微孔互连孔。
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