发明公开
- 专利标题： METHOD AND DEVICE FOR PLATING SUBSTRATE
- 专利标题（中）： 用于电镀基板的方法和装置
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申请号： EP99917206.7申请日： 1999-04-28
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公开(公告)号： EP1091024A1公开(公告)日： 2001-04-11
- 发明人: HONGO, Akihisa , NAGAI, Mizuki , OHNO, Kanji , KIMIZUKA, Ryoichi , MARUYAMA, Megumi
- 申请人： EBARA CORPORATION
- 申请人地址： 11-1, Haneda Asahi-cho Ohta-ku, Tokyo 144-8510 JP
- 专利权人： EBARA CORPORATION
- 当前专利权人： EBARA CORPORATION
- 当前专利权人地址： 11-1, Haneda Asahi-cho Ohta-ku, Tokyo 144-8510 JP
- 代理机构： Geyer, Ulrich F., Dr. Dipl.-Phys.
- 优先权： JP13615198 19980430; JP13615298 19980430
- 国际公布： WO9957342 19991111
- 主分类号： C25D7/12
- IPC分类号： C25D7/12
摘要：
A method and apparatus for plating a substrate is provided, wherein fine pits formed in the substrate, such as fine channels for wiring, are filled with a copper, copper alloy, or other material with low electrical resistance. The method is performed on a wafer W having fine pits (10) to fill the fine pits with a metal (13) and includes performing a first plating process (11) by immersing the wafer in a first plating solution having a composition superior in throwing power; and performing a second plating process (12) by immersing the substrate in a second plating solution having a composition superior in leveling ability.
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