发明公开
- 专利标题： PROCEDE DE BRASAGE PAR REFUSION DE COMPOSANTS ELECTRONIQUES ET DISPOSITIF DE BRASAGE POUR LA MISE EN OEUVRE D'UN TEL PROCEDE
- 专利标题（英）： Method for brazing by solder reflow electronic components and brazing device therefor
- 专利标题（中）： 方法和装置的电子元件的回流焊接
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申请号： EP99929437.4申请日： 1999-07-08
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公开(公告)号： EP1100644A1公开(公告)日： 2001-05-23
- 发明人: CARSAC, Claude , CONOR, Gilles , SINDZINGRE, Thierry , VERBOCKHAVEN, Denis
- 申请人： L'AIR LIQUIDE, SOCIETE ANONYME POURL'ETUDE ET L'EXPLOITATION DES PROCEDES GEORGES CLAUDE
- 申请人地址： 75, Quai d'Orsay 75321 Paris Cédex 07 FR
- 专利权人： L'AIR LIQUIDE, SOCIETE ANONYME POURL'ETUDE ET L'EXPLOITATION DES PROCEDES GEORGES CLAUDE
- 当前专利权人： L'AIR LIQUIDE, SOCIETE ANONYME POURL'ETUDE ET L'EXPLOITATION DES PROCEDES GEORGES CLAUDE
- 当前专利权人地址： 75, Quai d'Orsay 75321 Paris Cédex 07 FR
- 代理机构： Mellul-Bendelac, Sylvie Lisette
- 优先权： FR9809773 19980730
- 国际公布： WO0006333 20000210
- 主分类号： B23K1/012
- IPC分类号： B23K1/012
摘要：
The invention concerns a method for brazing by solder reflow electronic components (22) on a support, for example a printed circuit wafer (20) which consists in: arranging a solder alloy on the support (20) in sites for connecting the components (22); placing the components on the connection sites and brazing the components (22) properly speaking by a thermal treatment of the support, by contacting it, at a pressure close to atmospheric pressure, with a treating atmosphere comprising excited or unstable species substantially free from electrically charged species, the atmosphere being obtained by passing an initial treating gas in an electrical discharge, and the thermal treatment of the support being obtained by using the species thus heated by the action of the discharge.
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