专利检索 ap:("L'AIR LIQUIDE, SOCIETE ANONYME POURL'ETUDE ET L'EXPLOITATION DES PROCEDES GEORGES CLAUDE") AND inv:"CONOR, Gilles" 第 1 页

1.

发明公开
PROCEDE DE BRASAGE PAR REFUSION DE COMPOSANTS ELECTRONIQUES ET DISPOSITIF DE BRASAGE POUR LA MISE EN OEUVRE D'UN TEL PROCEDE 审中-公开
标题翻译：方法和装置的电子元件的回流焊接

公开(公告)号：EP1100644A1

公开(公告)日：2001-05-23

申请号：EP99929437.4

申请日：1999-07-08

申请人： L'AIR LIQUIDE, SOCIETE ANONYME POURL'ETUDE ET L'EXPLOITATION DES PROCEDES GEORGES CLAUDE

发明人： CARSAC, Claude , CONOR, Gilles , SINDZINGRE, Thierry , VERBOCKHAVEN, Denis

IPC分类号： B23K1/012

CPC分类号： H05K3/3494 , B23K1/012 , H05K2203/087 , H05K2203/095 , H05K2203/1157

摘要： The invention concerns a method for brazing by solder reflow electronic components (22) on a support, for example a printed circuit wafer (20) which consists in: arranging a solder alloy on the support (20) in sites for connecting the components (22); placing the components on the connection sites and brazing the components (22) properly speaking by a thermal treatment of the support, by contacting it, at a pressure close to atmospheric pressure, with a treating atmosphere comprising excited or unstable species substantially free from electrically charged species, the atmosphere being obtained by passing an initial treating gas in an electrical discharge, and the thermal treatment of the support being obtained by using the species thus heated by the action of the discharge.