发明公开
- 专利标题: METHOD AND APPARATUS FOR WAFER METROLOGY
- 专利标题(中): 方法和设备测量晶圆
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申请号: EP00921435.4申请日: 2000-03-22
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公开(公告)号: EP1163488A1公开(公告)日: 2001-12-19
- 发明人: STANKE, Fred, E. , WEBER-GRABAU, Michael , RUTH, Douglas, E. , TONG, Edric, H. , CAHILL, James, M., Jr. , CARLISLE, Clinton , BURKE, Elliot , PHAM, Hung
- 申请人: Sensys Instruments Corporation
- 申请人地址: 2090 Duane Avenue Santa Clara, CA 95054 US
- 专利权人: Sensys Instruments Corporation
- 当前专利权人: Sensys Instruments Corporation
- 当前专利权人地址: 2090 Duane Avenue Santa Clara, CA 95054 US
- 代理机构: Haines, Miles John
- 优先权: US125462P 19990322; US128915P 19990412; US143199P 19990709; US172851P 19991210; US495821 20000201
- 国际公布: WO0057127 20000928
- 主分类号: G01B11/06
- IPC分类号: G01B11/06 ; H01L21/66 ; G01N21/88 ; H01L21/304 ; C23C16/52
摘要:
This invention is an apparatus for imaging metrology, which in particular embodiments may be integrated with a processor station such that a metrology station is apart from but coupled to a process station. The metrology station is provided with a first imaging camera with a first field of view containing the measurement region. Alternate embodiments include a second imaging camera with a second field of view. Preferred embodiments comprise a broadband ultraviolet light source, although other embodiments may have a visible or near infrared light source of broad or narrow optical bandwidth. Embodiments including a broad bandwidth source typically include a spectrograph, or an imaging spectrograph. Particular embodiments may include curved, reflective optics or a measurement region wetted by a liquid. In a typical embodiment, the metrology station and the measurement region are configured to have 4 degrees of freedom of movement relative to each other.
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