An adhesive-dispensing method applies a pattern of adhesive onto a circuit-board carrier such that any discontinuities in the pattern, i.e. starting points, end-points or turning-points, are outside a footprint of a pair of substrates (11,12) or MMICs intended to be attached, adjacent each other and spaced apart, to the circuit-board, and in particular outside such footprint in the area of transition between one substrate/MMIC (11) and the other (12). The adhesive is preferably applied in straight lines and in a direction substantially transverse to the direction of transition (20) between the two substrates/MMICs (11,12).