发明公开
EP1213953A1 METHOD AND APPARATUS FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD 有权
设计方法ZUR HERSTELLUNG VON MEHRSCHICHTIGEN LEITERPLATTEN

METHOD AND APPARATUS FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD
摘要:
The present invention has an object to provide a producing method and producing apparatus of multilayered printed-circuit board that has eliminated the resin flow and resolved the problems of board thickness discrepancy and misregistration.
A producing method of multilayered printed-circuit board , comprising steps of stacking up a laminated sheet covered with conductive foil or conductor for outer layer, a prepreg and a laminated sheet covered with conductor for inner layer and, thereafter, setting the prepreg by pressurizing/heating, wherein, before conducting the pressurizing/heating, gas is sprayed to the surface of the laminated sheet covered with conductive foil or conductor for outer layer, a prepreg and a laminated sheet covered with conductor for inner layer to eliminate impurities from the surface.
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