公开(公告)号：EP1213953B1

公开(公告)日：2006-10-18

申请号：EP00950063.8

申请日：2000-08-11

申请人： Kabushiki Kaisha Daishodenshi ,  OHMI, Tadahiro

发明人： OHMI, Tadahiro ,  MURAKAMI, Hidetoshi, Kabushiki Kaisha Daishodenshi

IPC分类号： H05K3/46

CPC分类号： H05K3/4611 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913

摘要： A method and apparatus for manufacturing a multiplayer printed wiring board where the variation in the plate thickness and misregistration are eliminated by eliminating resin flow. The method for manufacturing a multiplayer printed wiring board by stacking a conductive foil or a conductor clad laminate sheet for the outer layer, a prepreg (5), and a conductor clad laminate sheet for the inner layer and then curing the prepreg (5) by hot press is characterized in that impurities are removed from the surface of the conductive foil or the conductor clad laminate sheet for outer layer, the prepreg (5), and the conductor clad laminate sheet for the inner layer by blowing gas (13) thereto before the hot press.

公开(公告)号：EP1213953A1

公开(公告)日：2002-06-12

申请号：EP00950063.8

申请日：2000-08-11

申请人： Kabushiki Kaisha Daishodenshi ,  Ohmi, Tadahiro

发明人： OHMI, Tadahiro ,  MURAKAMI, Hidetoshi, Kabushiki Kaisha Daishodenshi

IPC分类号： H05K3/46

CPC分类号： H05K3/4611 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913

摘要： The present invention has an object to provide a producing method and producing apparatus of multilayered printed-circuit board that has eliminated the resin flow and resolved the problems of board thickness discrepancy and misregistration.
A producing method of multilayered printed-circuit board , comprising steps of stacking up a laminated sheet covered with conductive foil or conductor for outer layer, a prepreg and a laminated sheet covered with conductor for inner layer and, thereafter, setting the prepreg by pressurizing/heating, wherein, before conducting the pressurizing/heating, gas is sprayed to the surface of the laminated sheet covered with conductive foil or conductor for outer layer, a prepreg and a laminated sheet covered with conductor for inner layer to eliminate impurities from the surface.

摘要翻译： 本发明的目的是提供一种消除树脂流动的多层印刷电路板的制造方法和制造装置，并且解决了板厚差异和重合不良的问题。 一种多层印刷电路板的制造方法，其特征在于，包括层叠有覆盖有导电箔或外层导体的层压片材，预浸料坯和被内层导体覆盖的层压片材，然后通过加压/ 加热，其中，在进行加压/加热之前，将气体喷射到覆盖有用于外层的导电箔或导体的层叠片材的表面，预浸料和覆盖有内层导体的层压片材以从表面除去杂质。