A method and apparatus (10) are provided for separating a discrete element (52) from a first substrate web (18), moving at a first speed, and placing the discrete element (52) on a second substrate web (20), moving at a second speed. The apparatus (10) includes a first station (24), wherein perforations are made in the first substrate web (18), and a second station (44), wherein the discrete element (52) is separated from the first substrate web (18) at a line of perforations and the discrete element (52) is transferred to a position on the second substrate web (20). The first station (24) includes a perforation cutter assembly (28) and conveyer assembly (46). The perforation cutter assembly (28) includes first (30) and second (32) rollers with a cutting blade, with a discontinuous edge, and an anvil surface, respectively, to make perforations in the first substrate web (18). The second station (44) includes a separation and transfer mechanism (12) having separation and transfer segments (54) for separating and transferring the discrete element (52) from the first substrate web (18) to the second substrate web (20). The method includes the steps of: making perforations across a width, at least partially through a thickness, and at predetermined spaced apart intervals along a length of the first substrate web (18); separating the discrete element (52) from the first substrate (18) web along a first line of the perforations; and placing the discrete element (52) on the second substrate web (20).