The invention relates to a method for encapsulating components which are based on organic semiconductors, whereby a housing is glued to a substrate. A UV-curable reaction adhesive is used in the gluing process which contains an epoxy resin, a hydroxy functional reaction product formed from an epoxy compound and a phenolic compound, a silane-type adhesive and a photoinitiator, in addition to an optional filler. The method is particularly suitable for encapsulating organic light-emitting diodes (OLEDs).