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1.发明授权POLYMERE, PHOSPHORESZIERENDE, ORGANISCH HALBLEITENDE EMITTERMATERIALIEN AUF BASIS PERARYLIERTER BORANE, VERFAHREN ZU DEREN HERSTELLUNG UND VERWENDUNGEN DAVON 有权聚合物，磷光，因为他们的用途组织发射极材料，以PERARYLIERTER硼烷及其方法的有机同父异母及
公开(公告)号：EP1699898B1
公开(公告)日：2008-10-29
申请号：EP04816282.0
申请日：2004-12-29
CPC分类号： H01L51/0079 , C07F15/0033 , C08G79/00 , C08G79/08 , C08G79/14 , C09K11/06 , C09K2211/1007 , C09K2211/1011 , C09K2211/1022 , C09K2211/1029 , C09K2211/1044 , C09K2211/1051 , C09K2211/1416 , C09K2211/1425 , C09K2211/1458 , C09K2211/1466 , C09K2211/1475 , C09K2211/1483 , C09K2211/185 , H01L51/0035 , H01L51/0043 , H01L51/0085
摘要： The invention relates to luminescent compounds with semi-conductive characteristics, in addition to their production and their use in organic light-emitting diodes (OLEDS). Said compounds are copolymers comprising a metal complex with a central atom from the eighth sub-group of the periodic table.
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2.发明公开POLYMERE, PHOSPHORESZIERENDE, ORGANISCH HALBLEITENDE EMITTERMATERIALIEN AUF BASIS PERARYLIERTER BORANE, VERFAHREN ZU DEREN HERSTELLUNG UND VERWENDUNGEN DAVON 有权聚合物，磷光，因为他们的用途组织发射极材料，以PERARYLIERTER硼烷及其方法的有机同父异母及
公开(公告)号：EP1699898A1
公开(公告)日：2006-09-13
申请号：EP04816282.0
申请日：2004-12-29
CPC分类号： H01L51/0079 , C07F15/0033 , C08G79/00 , C08G79/08 , C08G79/14 , C09K11/06 , C09K2211/1007 , C09K2211/1011 , C09K2211/1022 , C09K2211/1029 , C09K2211/1044 , C09K2211/1051 , C09K2211/1416 , C09K2211/1425 , C09K2211/1458 , C09K2211/1466 , C09K2211/1475 , C09K2211/1483 , C09K2211/185 , H01L51/0035 , H01L51/0043 , H01L51/0085
摘要： The invention relates to luminescent compounds with semi-conductive characteristics, in addition to their production and their use in organic light-emitting diodes (OLEDS). Said compounds are copolymers comprising a metal complex with a central atom from the eighth sub-group of the periodic table.
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3.发明公开
公开(公告)号：EP1399980A2
公开(公告)日：2004-03-24
申请号：EP02747223.2
申请日：2002-06-17
发明人： ROTH, Wolfgang
CPC分类号： H01L51/56 , H01L51/0016 , H01L51/5253
摘要： The invention relates to a method for producing a polymer-free area, characterized by applying at least one peelable layer to the substrate, and/or to one or more polymer layer(s) disposed on the substrate, in those areas where a polymer-free area is formed on the substrate by removing the peelable layer. The invention thus provides a method for producing polymer-free bonding areas or, by disposing a diode protecting cap on the polymer-free area of the substrate, a hermetically sealed link between the substrate and the diode protecting cap.
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公开(公告)号：EP1218950B1
公开(公告)日：2005-06-01
申请号：EP00963970.9
申请日：2000-09-06
发明人： BAYER, Heiner , ROTH, Wolfgang , ROGLER, Wolfgang
IPC分类号： H01L51/20
CPC分类号： H01L51/5246
摘要： The invention relates to a method for encapsulating components which are based on organic semiconductors, whereby a housing is glued to a substrate. A UV-curable reaction adhesive is used in the gluing process which contains an epoxy resin, a hydroxy functional reaction product formed from an epoxy compound and a phenolic compound, a silane-type adhesive and a photoinitiator, in addition to an optional filler. The method is particularly suitable for encapsulating organic light-emitting diodes (OLEDs).
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