A polypropylene film having a tensile modulus TM (MPa) and a heat-sealing temperature HST (°C) which satisfy the relationship TM≥12.5xHST-900. It has an excellent balance between modulus and heat-sealing temperature, is nontacky, and is excellent in formability, transparency, and impact resistance. Also disclosed is a multilayered polyolefin resin laminate in which at least one of the outermost layers is constituted of the polypropylene film. This laminate has an excellent balance between modulus and heat-sealing temperature, is nontacky, and is excellent in slip properties and antiblocking properties.