发明授权
EP1245621B1 Porous para-oriented aromatic polyamide film, prepreg thereof, and base substrate for printed circuit board 有权
多孔对位取向芳香族聚酰胺薄膜,用于印刷电路板本膜与基底基板的预浸料坯

Porous para-oriented aromatic polyamide film, prepreg thereof, and base substrate for printed circuit board
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