发明授权
EP1248865B1 ATOMIC-LAYER-CHEMICAL-VAPOR-DEPOSITION OF FILMS THAT CONTAIN SILICON DIOXIDE
有权
CVD SLIZIUMDIOXID-含硅薄膜的个原子层
- 专利标题: ATOMIC-LAYER-CHEMICAL-VAPOR-DEPOSITION OF FILMS THAT CONTAIN SILICON DIOXIDE
- 专利标题(中): CVD SLIZIUMDIOXID-含硅薄膜的个原子层
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申请号: EP00987492.6申请日: 2000-12-04
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公开(公告)号: EP1248865B1公开(公告)日: 2016-10-05
- 发明人: ARO, Eva , HAUKKA, Suvi , TUOMINEN, Marko
- 申请人: ASM INTERNATIONAL N.V.
- 申请人地址: Jan van Eycklaan 10 3723 BC Bilthoven NL
- 专利权人: ASM INTERNATIONAL N.V.
- 当前专利权人: ASM INTERNATIONAL N.V.
- 当前专利权人地址: Jan van Eycklaan 10 3723 BC Bilthoven NL
- 代理机构: Seppo Laine Oy
- 优先权: FI992616 19991203
- 国际公布: WO2001040541 20010607
- 主分类号: H01L21/316
- IPC分类号: H01L21/316 ; C23C16/40 ; C23C16/44 ; C30B25/02 ; C23C16/455 ; H01L21/02 ; C30B29/16
摘要:
Process for producing silicon oxide containing thin films on a growth substrate by the ALCVD method. In the process, a vaporizable silicon compound is bonded to the growth substrate, and the bonded silicon compound is converted to silicon dioxide. The invention comprises using a silicon compound which contains at least one organic ligand and the bonded silicon compound is converted to silicon dioxide by contacting it with a vaporized, reactive oxygen source, in particular with ozone. The present invention provides a controlled process for growing controlling thin films containing SiO2, with sufficiently short reaction times.
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