发明公开
EP1266863A3 Multi-level integrated circuit for wide-gap substrate bonding
审中-公开
用于Substratverklebung的多层集成电路具有大的距离
- 专利标题： Multi-level integrated circuit for wide-gap substrate bonding
- 专利标题（中）： 用于Substratverklebung的多层集成电路具有大的距离
-
申请号： EP02253722.9申请日： 2002-05-28
-
公开(公告)号： EP1266863A3公开(公告)日： 2004-11-17
- 发明人: Regan, Michael J. , Liebeskind, John , Haluzak, Charles C.
- 申请人： Hewlett-Packard Company
- 申请人地址： 3000 Hanover Street Palo Alto, CA 94304 US
- 专利权人： Hewlett-Packard Company
- 当前专利权人： Hewlett-Packard Company
- 当前专利权人地址： 3000 Hanover Street Palo Alto, CA 94304 US
- 代理机构： Jackson, Richard Eric
- 优先权： US879876 20010611
- 主分类号： B81B7/00
- IPC分类号： B81B7/00
摘要：
An integrated circuit (30) includes a substrate (10) having an etched surface and a non-etched surface. The etched surface contains circuit elements (22, 24) and the non-etched surface contains a bonding surface (18). The non-etched surface is located at a predetermined height (12) from the etched surface. Bonding this integrated circuit (30) with another substrate creates a wide-gap between the substrates that is preferably evacuated and hermetically sealed.
公开/授权文献
信息查询
