发明公开
EP1272020A4 METHOD OF MANUFACTURING CERAMIC MULTI-LAYER SUBSTRATE, AND UNBAKED COMPOSITE LAMINATED BODY
有权
一种用于生产多层陶瓷基板和未烧结层压复合体,
- 专利标题: METHOD OF MANUFACTURING CERAMIC MULTI-LAYER SUBSTRATE, AND UNBAKED COMPOSITE LAMINATED BODY
- 专利标题(中): 一种用于生产多层陶瓷基板和未烧结层压复合体,
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申请号: EP01997979申请日: 2001-11-22
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公开(公告)号: EP1272020A4公开(公告)日: 2007-07-04
- 发明人: SAITOH YOSHIFUMI , KAWAKAMI HIROMICHI
- 申请人: MURATA MANUFACTURING CO
- 专利权人: MURATA MANUFACTURING CO
- 当前专利权人: MURATA MANUFACTURING CO
- 优先权: JP2000359026 2000-11-27; JP2000359027 2000-11-27; JP2000360582 2000-11-28; JP2000372262 2000-12-07
- 主分类号: B28B11/24
- IPC分类号: B28B11/24 ; B28B17/00 ; B32B18/00 ; B32B37/00 ; C04B35/638 ; H01L21/48 ; H01L23/15 ; H05K1/03 ; H05K3/00 ; H05K3/46 ; B28B11/00 ; H01L23/12
摘要:
A method of manufacturing a ceramic multi-layer substrate, comprising a first process for manufacturing an unbaked composite laminated body (11) having a first contraction suppressing layer (13) and a second contraction suppressing layer (14) on one principal plane and the other principal plane of an unbaked multi-layer collecting substrate (12) formed of a plurality of ceramic green layers (17) stacked each other, a second process for forming cut-in grooves (16) reaching a part of the multi-layer collecting substrate (12) from the first contraction suppressing layer (13) side through the first contraction suppressing layer (13), a third process for baking the composite laminated body (11), a fourth process for removing the first and second contraction suppressing layers (13) and (14) and taking out the baked multi-layer collecting substrate (11), and a fifth process for taking out a plurality of ceramic multi-layer substrates by dividing the multi-layer collecting substrate along the cut-in grooves (16), whereby the ceramic multi-layer substrate with high dimensional accuracy and high reliability can be provided with high productivity by suppressing the contraction thereof in flat surface direction at the time of baking.
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