Disclosed is a radio frequency circuit having a membrane structure and manufacturing method for the same. The radio frequency circuit has a circuit element formed on an insulating material plate having copper bonded on both surfaces or one surface thereof whereby a metal substrate having a hollow bore and the insulating material plate forming the circuit element are bonded together. The circuit element is mounted with an active element on which a lid having a partition wall is bonded for packaging. The hollow bore in the metal substrate, for forming a membrane structure, is formed by press-blanking. Because the metal substrate is not wet-etched, dimensions control can be easily, precisely made on a hollow bore region of the metal substrate. Furthermore, it is possible to shorten the working time on the hollow bore region.