发明公开
EP1276153A4 CIRCUIT BOARD AND PRODUCTION METHOD THEREFOR
审中-公开
LEITERPLATTE UND VERFAHREN ZU IHRER HERSTELLUNG
- 专利标题： CIRCUIT BOARD AND PRODUCTION METHOD THEREFOR
- 专利标题（中）： LEITERPLATTE UND VERFAHREN ZU IHRER HERSTELLUNG
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申请号： EP02729533申请日： 2002-01-10
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公开(公告)号： EP1276153A4公开(公告)日： 2005-05-25
- 发明人: SUZUMURA MASAKI , OKADA KAZUO , HIRANO KOICHI , OKAWA TAKAAKI , TANAKA SHINYA
- 申请人： MATSUSHITA ELECTRIC IND CO LTD
- 专利权人： MATSUSHITA ELECTRIC IND CO LTD
- 当前专利权人： MATSUSHITA ELECTRIC IND CO LTD
- 优先权： JP2001003312 2001-01-11; JP2001003313 2001-01-11
- 主分类号： H01L23/498
- IPC分类号： H01L23/498 ; H01L23/538 ; H05K3/00 ; H05K3/04 ; H05K3/20 ; H05K3/28 ; H01L25/04 ; H01L23/12 ; H01L23/50
摘要：
A lead frame on a circuit board is punched in a direction opposite to a radiation sheet, and burr, even if made by the punching, does not pass through a sheet to short-circuit the radiation sheet. A resist film is bonded to the land outer periphery of the lead frame of the circuit board, and plating film is bonded to the land surface to thereby prevent an incorrect mounting of electronic parts onto the land.
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