发明公开
- 专利标题： CIRCUIT BOARD AND PRODUCTION METHOD THEREOF
- 专利标题（中）： 电路板及其制造方法
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申请号： EP02729553.4申请日： 2002-01-11
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公开(公告)号： EP1278404A1公开(公告)日： 2003-01-22
- 发明人: SUGAWA, Toshio , MURAKAWA, Satoshi , HAYAMA, Masaaki , YASUHO, Takeo
- 申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- 申请人地址： 1006, Oaza-Kadoma Kadoma-shi, Osaka 571-8501 JP
- 专利权人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- 当前专利权人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- 当前专利权人地址： 1006, Oaza-Kadoma Kadoma-shi, Osaka 571-8501 JP
- 代理机构： Grünecker, Kinkeldey, Stockmair & Schwanhäusser Anwaltssozietät
- 优先权： JP2001006024 20010115
- 国际公布： WO02056651 20020718
- 主分类号： H05K1/11
- IPC分类号： H05K1/11 ; H05K3/40
摘要：
A circuit board is manufactured by filling a via-hole formed in an insulating substrate with conductive material, disposing conductive layers on both sides of the insulating substrate, and forming alloy of component material of the conductive material with component material of the conductive layers. In the circuit board, therefore, the conductive material filled in the via-hole formed in the insulating substrate is securely connected electrically as well as mechanically to the conductive layers on both sides of the insulating substrate with high reliability.
公开/授权文献
- EP1278404B1 CIRCUIT BOARD AND PRODUCTION METHOD THEREOF 公开/授权日：2008-03-12
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