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公开(公告)号：EP1357597B1
公开(公告)日：2008-11-05
申请号：EP02800768.0
申请日：2002-10-04
CPC分类号： H01L23/5389 , H01L25/162 , H01L25/165 , H01L2224/16 , H01L2924/19105 , H05K1/185 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003
摘要： A voltage conversion module is formed by a mulitilayered laminate of a first connection layer, first inner wiring face, component built-in layer, second inner wiring face, second connection layer, capacitor mounted face, and capacitor built-in layer with a resin composite. The connection terminal of the terminal face of the first connection layer, first inner wiring face, second inner wiring face, and capacitor mounted face are electrically coupled with a viahole conductor (via). The second inner wiring face couples a voltage conversion IC built in the component built-in layer with a peripheral component. The first and second capacitors built in the capacitor built-in layer are mounted on the capacitor mounting face. Thus, a circuit of coupled first and second capacitors is formed between the terminal of the voltage conversion IC and the ground.
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2.发明公开METHOD OF MANUFACTURING MULTILAYER CERAMIC SUBSTRATE, AND CONDUCTOR PASTE 有权HERTELLUNGSMETHODEFÜREIN MEHRSCHICHTIGES KERAMISCHES SUBSTRAT
公开(公告)号：EP1189495A1
公开(公告)日：2002-03-20
申请号：EP01912383.5
申请日：2001-03-15
CPC分类号： H01L21/4857 , H01L21/4867 , H05K3/4664
摘要： The present invention provides a method of manufacturing a low-temperature sintering multilayer ceramic wiring board comprising the steps of: forming a wiring layer by printing conductive paste (4) on an unfired green sheet (1); forming a laminate by laminating, on at least one side of a ceramic substrate, the unfired green sheet having the wiring layer; and firing the laminate. The present invention also provides paste for use with this method. In the firing step, after an adhesive layer (8) or binder resin in said green sheet used for lamination burns, glass ceramic in the green sheet starts to sinter, and upon or after the start of sintering of the glass ceramic, conductive particles in the conductive paste starts to sinter. This manufacturing method can provide an precise wiring board without pattern deformation and also provide a low-temperature ceramic multilayer wiring board that has no cracks in the glass ceramic on the periphery of electrodes and has electrodes of a dense film structure.
摘要翻译： 本发明提供一种制造低温烧结多层陶瓷布线板的方法，包括以下步骤：通过在未烧结的生片（1）上印刷导电浆料（4）形成布线层; 在陶瓷基板的至少一侧层叠具有布线层的未烧成的生片，形成层叠体; 并烧制层压板。 本发明还提供了用于该方法的糊剂。 在烧成工序中，在用于层压燃烧的生片中的粘合剂层（8）或粘合剂树脂之后，生片中的玻璃陶瓷开始烧结，玻璃陶瓷的烧结开始或之后，导电粒子 导电膏开始烧结。 该制造方法可以提供没有图案变形的精确布线板，并且还提供在电极周边的玻璃陶瓷中没有裂纹并且具有致密膜结构的电极的低温陶瓷多层布线板。
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公开(公告)号：EP1450400A1
公开(公告)日：2004-08-25
申请号：EP03791264.9
申请日：2003-08-25
IPC分类号： H01L23/28
CPC分类号： H01L23/3121 , H01L23/13 , H01L23/552 , H01L2924/0002 , H01L2924/19041 , H01L2924/3025 , H05K1/0218 , H05K3/0052 , H05K3/284 , H05K3/403 , H01L2924/00
摘要： A module component is provided having a sufficient shield effect and fabricated low in height.
On a circuit board (10), a mount device (30) comprising an electronic part is mounted, and this mount device (30) is sealed with a sealing body (40). On the surface of this sealing body (40), a metal film (20) is formed. A ground pattern (50) is formed at the outer periphery of the principal surface of the circuit board (10), and a configuration is formed in which said metal film (20) is conductively connected with the ground pattern (50).摘要翻译： 提供具有足够的屏蔽效果并且制造得较低的模块组件。 在电路基板（10）上安装有由电子部件构成的安装装置（30），该安装装置（30）由密封体（40）密封。 在该密封体（40）的表面上形成金属膜（20）。 接地图案（50）形成在电路板（10）的主表面的外周处，并且形成其中所述金属膜（20）与接地图案（50）导电连接的构造。
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公开(公告)号：EP1365451A1
公开(公告)日：2003-11-26
申请号：EP02801549.3
申请日：2002-10-11
CPC分类号： H01L21/4857 , G06K19/07749 , G06K19/07779 , G06K19/07783 , G06K19/07784 , H01F17/0013 , H01F27/40 , H01F2017/0026 , H01L23/5388 , H01L23/645 , H01L2224/05548 , H01L2224/05573 , H01L2224/16 , H01L2224/2402 , H01L2924/00011 , H01L2924/00014 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/181 , H01L2924/30107 , H05K1/0298 , H05K1/165 , H05K1/185 , H05K2201/086 , H05K2201/10416 , H01L2924/00 , H01L2224/48 , H01L2224/05599 , H01L2924/00012 , H01L2924/01005
摘要： A module component includes a wiring circuit pattern formed on an insulated resin layer, and a connecting conductor, which is formed within the insulated resin layers, for electrically connecting at least two of the wiring circuit patterns each other. The module component further includes an active component and a passive component, which are formed on at least one of the wiring circuit patterns and electrically connected thereto, and a coil formed within a laminated member. The coil is formed of a coil pattern made of a conductive material, and formed on the insulated resin layer. Magnetic materials, which are formed on the insulated resin layers, sandwich the coil pattern.
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公开(公告)号：EP1416532A1
公开(公告)日：2004-05-06
申请号：EP03736220.9
申请日：2003-06-16
IPC分类号： H01L23/28
CPC分类号： H01L23/552 , H01L23/3121 , H01L23/60 , H01L24/83 , H01L2224/2929 , H01L2224/293 , H01L2224/83851 , H01L2924/00011 , H01L2924/19041 , H01L2924/19105 , H01L2924/3025 , H05K1/0218 , H05K3/284 , H01L2224/29075 , H01L2924/00014
摘要： A module includes a component, a circuit board having the component mounted thereon, a first grounding pattern formed on an outermost periphery of a surface portion of the circuit board; a first sealer provided on the circuit board and having a dimension projected on the circuit board, and a metal film covering the sealer and connected to the grounding pattern. The dimension of the first dealer is smaller than an outside dimension of the circuit board. The first sealer is made of first resin and sealing the component. The module has a low profile and is adequately shielded.
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公开(公告)号：EP1357597A1
公开(公告)日：2003-10-29
申请号：EP02800768.0
申请日：2002-10-04
CPC分类号： H01L23/5389 , H01L25/162 , H01L25/165 , H01L2224/16 , H01L2924/19105 , H05K1/185 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003
摘要： A voltage converter module is formed by multi-layering a first connecting layer, a first inner wiring layer, a component built-in layer, a second inner wiring layer, a second connecting layer, and a capacitor-mounted layer, and a capacitor built-in layer with resin composite. A connecting terminal formed on a terminal surface of the first connecting layer, the first inner wiring layer, the second inner wiring layer and the capacitor-mounted layer are electrically coupled to each other through via-hole conductors. The second inner wiring layer couples a voltage converter IC to peripheral components, both being incorporated in the component built-in layer. A first capacitor and a second capacitor incorporated in the capacitor built-in layer are mounted to the capacitor-mounted layer. This structure forms a circuit, in which the first capacitor is coupled to the second capacitor, between the voltage converter IC and the grounding.
摘要翻译： 电压转换器模块通过多层第一连接层，第一内部布线层，部件内置层，第二内部布线层，第二连接层和电容器安装层，以及构成的电容器 - 与树脂复合层。 形成在第一连接层的端子表面上的连接端子，第一内部布线层，第二内部布线层和电容器安装层通过通孔导体彼此电耦合。 第二内部布线层将电压转换器IC耦合到周边部件，两者都被并入组件内置层中。 集成在电容器内置层中的第一电容器和第二电容器安装到电容器安装层。 这种结构形成电路，其中第一电容器耦合到第二电容器，在电压转换器IC和接地之间。
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公开(公告)号：EP1278404B1
公开(公告)日：2008-03-12
申请号：EP02729553.4
申请日：2002-01-11
CPC分类号： H05K3/4069 , H05K1/095 , H05K2201/0305 , H05K2201/0317 , H05K2201/0355 , H05K2203/1461 , Y10T29/49155 , Y10T428/24917
摘要： A circuit board produced by the step of filling a via hole (102), formed in an insulating substrate (101), with a conductive material (103), the step of providing conductive layers (104) on the opposite surface of the insulating substrate, and the step of alloying the component materials of the conductive material with those of the conductive layer. The conductive material filled in the via hole provided in the insulating substrate and conductive layers on the opposite surfaces of insulating substrate are electrically and mechanically connected together so as to positively ensure a high reliability.
摘要翻译： 通过在导电材料（103）上填充形成在绝缘衬底（101）中的通孔（102）的步骤制造的电路板，在绝缘衬底（101）的相对表面上提供导电层（104） 以及将导电材料的组分材料与导电材料的组分材料合金化的步骤。 填充在设置在绝缘基板中的通孔中的导电材料和绝缘基板的相对表面上的导电层被电连接和机械连接在一起，从而确实确保高可靠性。
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公开(公告)号：EP1278404A1
公开(公告)日：2003-01-22
申请号：EP02729553.4
申请日：2002-01-11
CPC分类号： H05K3/4069 , H05K1/095 , H05K2201/0305 , H05K2201/0317 , H05K2201/0355 , H05K2203/1461 , Y10T29/49155 , Y10T428/24917
摘要： A circuit board is manufactured by filling a via-hole formed in an insulating substrate with conductive material, disposing conductive layers on both sides of the insulating substrate, and forming alloy of component material of the conductive material with component material of the conductive layers. In the circuit board, therefore, the conductive material filled in the via-hole formed in the insulating substrate is securely connected electrically as well as mechanically to the conductive layers on both sides of the insulating substrate with high reliability.
摘要翻译： 通过在绝缘基板中形成的通孔中填充导电材料，在绝缘基板的两侧设置导电层，并且将导电材料的组分材料与导电层的组分材料形成合金，从而制造电路板。 因此，在电路板中，填充在形成在绝缘基板中的通孔中的导电材料与绝缘基板两侧的导电层以可靠的方式牢固地电连接和机械连接。
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公开(公告)号：EP1478023A1
公开(公告)日：2004-11-17
申请号：EP03705323.8
申请日：2003-02-19
IPC分类号： H01L25/04
CPC分类号： G01R31/02 , G01R31/28 , H01L21/4857 , H01L21/563 , H01L23/49822 , H01L23/5385 , H01L23/5389 , H01L24/16 , H01L24/97 , H01L25/0652 , H01L2224/13099 , H01L2224/16225 , H01L2224/16235 , H01L2224/16237 , H01L2224/32225 , H01L2224/45144 , H01L2224/73204 , H01L2224/8114 , H01L2224/97 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01088 , H01L2924/014 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/16152 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/3025 , H01L2924/351 , H05K1/16 , H05K1/186 , H05K3/20 , H05K3/4069 , H05K3/4614 , H05K2201/0723 , H05K2203/063 , H05K2203/1147 , H05K2203/167 , H05K2203/171 , H01L2224/81 , H01L2924/00 , H01L2924/00012 , H01L2224/0401
摘要： A module component which includes circuit substrate 3 having one or more components 1 on at least one of the surfaces, and junction circuit substrate 5 having hollow 4, or hole, disposed corresponding to the portion of the one or more components 1 mounted on the one surface of circuit substrate 3 for fitting the mounted components 1 in. These substrates are laminated to form a single body so that mounted components 1 is contained within the inside. The above configuration ensures high reliability in the layer-to-layer connection, and enables to mount a plurality of components densely with a high dimensional accuracy. Thus a highly reliable compact module component is offered.
摘要翻译： 一种模块部件，其包括在至少一个表面上具有一个或多个部件1的电路基板3，以及具有中空部分4或孔的接合电路基板5，所述连接基板5与安装在该一个上的一个或多个部件1的部分相对应 用于安装安装部件1的电路基板3的表面。这些基板被层叠以形成单体，从而将安装部件1包含在内部。 上述配置确保了层间连接的高可靠性，并且能够以高尺寸精度密集地安装多个部件。 因此提供了高度可靠的紧凑型模块组件。
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公开(公告)号：EP1233528A1
公开(公告)日：2002-08-21
申请号：EP01974706.2
申请日：2001-10-05
IPC分类号： H04B1/40
CPC分类号： H04B1/50 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/73204 , H01L2924/00014 , H01L2924/16152 , H01L2924/19105 , H04B1/406 , H04B1/48 , H01L2924/00 , H01L2224/0401
摘要： A small radio-frequency hybrid switch module is provided for switching between transmitted signals and received signals in plural frequency bands. This module includes: a laminated body including a dielectric layer; a diplexer; a switching circuit; a low pass filter (LPF); a conductive pattern provided on the dielectric layer for forming at least one of the diplexer, the switching circuit and the LPF; a surface acoustic wave (SAW) filter mounted on the laminated body; a cover provided on the SAW filter for forming a cavity which allows surface acoustic wave vibration and for hermetically sealing the cavity; and a semiconductor switching device mounted on the laminated body for forming a part of the switching circuit.
摘要翻译： 提供了一种小型射频混合开关模块，用于在多个频带中的发射信号和接收信号之间切换。 该模块包括：包括电介质层的层叠体; 双工器 开关电路; 低通滤波器（LPF）; 设置在电介质层上的用于形成双工器，开关电路和LPF中的至少一个的导电图案; 安装在层叠体上的表面声波（SAW）滤波器; 设置在所述SAW滤波器上用于形成空腔的盖，所述空腔允许表面声波振动并用于气密地密封所述空腔; 以及安装在层叠体上用于形成开关电路的一部分的半导体开关装置。
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