发明公开
EP1374298A1 CHIP MODULE WITH BOND-WIRE CONNECTIONS WITH SMALL LOOP HEIGHT
审中-公开
芝麻IT IT E E E E E E E E E E E E E E E E E E E
- 专利标题： CHIP MODULE WITH BOND-WIRE CONNECTIONS WITH SMALL LOOP HEIGHT
- 专利标题（中）： 芝麻IT IT E E E E E E E E E E E E E E E E E E E
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申请号： EP02712153.2申请日： 2002-02-18
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公开(公告)号： EP1374298A1公开(公告)日： 2004-01-02
- 发明人: SCHOBER, Joachim, H. , TOTH, Marcus
- 申请人： Koninklijke Philips Electronics N.V.
- 申请人地址： Groenewoudseweg 1 5621 BA Eindhoven NL
- 专利权人： Koninklijke Philips Electronics N.V.
- 当前专利权人： Koninklijke Philips Electronics N.V.
- 当前专利权人地址： Groenewoudseweg 1 5621 BA Eindhoven NL
- 代理机构： Weber, Helmut
- 优先权： EP01890093 20010323
- 国际公布： WO2002078080 20021003
- 主分类号： H01L21/607
- IPC分类号： H01L21/607 ; H01L23/31
摘要：
In a data carrier (1) with a chip module (3), the chip (5) of the chip module (3) is provided, in the region of its chip connecting layers (8), with a respective wire connecting means which is formed by a flat metal layer (10) and whereto an end (13), bonded in a wedge-shape fashion, of a bond wire (11) is connected.
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