公开(公告)号：EP1374298A1

公开(公告)日：2004-01-02

申请号：EP02712153.2

申请日：2002-02-18

申请人： Koninklijke Philips Electronics N.V.

发明人： SCHOBER, Joachim, H. ,  TOTH, Marcus

IPC分类号： H01L21/607 ,  H01L23/31

CPC分类号： H01L24/85 ,  H01L23/3121 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/04042 ,  H01L2224/05144 ,  H01L2224/05611 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/48611 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/078 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/4554

摘要： In a data carrier (1) with a chip module (3), the chip (5) of the chip module (3) is provided, in the region of its chip connecting layers (8), with a respective wire connecting means which is formed by a flat metal layer (10) and whereto an end (13), bonded in a wedge-shape fashion, of a bond wire (11) is connected.

摘要翻译： 在具有芯片模块（3）的数据载体（1）中，芯片模块（3）的芯片（5）在其芯片连接层（8）的区域中设置有相应的导线连接装置 由平坦金属层（10）形成，并且连接有接合线（11）的以楔形方式接合的端部（13）。

公开(公告)号：EP1327226A1

公开(公告)日：2003-07-16

申请号：EP01982364.0

申请日：2001-09-26

申请人： Koninklijke Philips Electronics N.V.

发明人： AFLENZER, Gunter ,  SCHOBER, Joachim, H. ,  TOTH, Marcus

IPC分类号： G06K19/077

CPC分类号： G06K19/077 ,  G06K19/07745 ,  G06K19/07749 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

摘要： A module (1) for contactless communication includes a plurality of electrical components (4, 5, 6, 7, 8) which each have at least two contact faces (9, 10, 11, 12, 13, 14, 15, 16) for the electrical connection. The electrical components (4, 5, 6, 7, 8) of the module are mounted both on a component side (MB) and an on adhesive side (MK) of a lead frame (M) formed by metal strips (MS). During the manufacture of the module (1) the metal strips (MS) of the lead frame (M) are held in one plane (E) and in position by means of an adhesive tape (K). The adhesive tape (K) has openings (A1, A2, A3, A4, A5, A6) at given positions of the lead frame (M) so as to enable electrical components to be mounted on the adhesive side (MK) of the lead frame (M).

公开(公告)号：EP1055194A1

公开(公告)日：2000-11-29

申请号：EP99968350.1

申请日：1999-12-14

申请人： Koninklijke Philips Electronics N.V.

发明人： TOTH, Marcus ,  SCHEUCHER, Wolfgang ,  SCHAFFLER, Gerald ,  KWAS, Heinz

IPC分类号： G06K19/077

CPC分类号： G06K19/048 ,  G06K19/07749

摘要： The data carrier (4) of a device (1) provided with a data carrier (4) includes a casing (5) which is formed by injection molding and in which there are accommodated holding means (6) for holding a chip (7) and at least one transmission coil (8), and also includes electrically conductive connection means (16) which are connected to the holding means (6) and are arranged to connect the chip terminals (9, 10) of the chip (7) to the coil terminals (11, 12) of the transmission coil (8); the holding means include a holding foil (17) and the connection means (16) are realized while utilizing a conductor frame (18) and are formed by conductor segments (20, 21, 22, 23, 24, 25, 28, 29, 30, 31) of the conductor frame (18), parts of said conductor segments (20, 21, 22, 23, 24, 25, 28, 29, 30, 31) being connected to the holding foil (17) in order to hold said conductor segments, the entire holding foil (17) and the parts of the conductor segments (20, 21, 22, 23, 24, 25, 28, 29, 30, 31) which are connected to the holding foil (17) being fully enclosed by the casing (5).

公开(公告)号：EP1290631A1

公开(公告)日：2003-03-12

申请号：EP01931682.7

申请日：2001-05-01

申请人： Koninklijke Philips Electronics N.V.

发明人： TOTH, Marcus ,  SCHOBER, Joachim, H. ,  SCHMALLEGGER, Peter ,  SAUER, Veronika

IPC分类号： G06K19/077

CPC分类号： G06K19/07728 ,  G06K19/07745 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/484 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2224/45099 ,  H01L2924/00012

摘要： A data carrier (1) includes an IC module (3), having a substrate (4), and a conductor configuration (5) connected to the substrate (4), and an IC (2) connected to the substrate (4), and connecting leads (10, 11) between the conductor configuration (5) and the IC (2), and a cover (12) of an electrically insulating material, which cover (12) shrouds the IC (2) and the connecting leads (10, 11) and the portions (13, 14, 15) of the conductor configuration (5) The data carrier (1) is equipped with a protection mechanism (20) that provides protection against damage to at least a part of the IC module (3) when the IC module (3) is bent or twisted, which protection mechanism (20) forms a part of the IC module (3), consists of a ductile material, and is formed by a layer-shaped, preferably net-like, cap which is encased in the cover (12) up to the substrate means (4).

公开(公告)号：EP1055193A1

公开(公告)日：2000-11-29

申请号：EP99963503.0

申请日：1999-12-13

申请人： Koninklijke Philips Electronics N.V.

发明人： TOTH, Marcus ,  SCHEUCHER, Wolfgang ,  SCHAFFLER, Gerald ,  KWAS, Heinz

IPC分类号： G06K19/077

CPC分类号： G06K19/07749 ,  G07C9/00944 ,  G07C2009/00769 ,  H01L2924/0002 ,  Y10T29/49124 ,  Y10T29/49155 ,  H01L2924/00

摘要： The data carrier (4) of a device (1) provided with a data carrier (4) includes a casing (5) which is formed by injection molding and in which there are accommodated holding means (6) for holding a chip (7) and at least one transmission coil (8), and also includes electrically conductive connection means (16) which are connected to the holding means (6) and are arranged to connect the chip terminals (9, 10) of the chip (7) to the coil terminals (11, 12) of the transmission coil (8); the holding means (6) include a holding foil (17) and the connection means (16) are realized while utilizing a conductor frame (18) and are formed by conductor segments (20, 21, 22, 23, 24, 25, 28, 29, 30, 31; 42, 43, 45, 46) of the conductor frame (18) and are completely enclosed by the casing (5), at least parts of said conductor segments (20, 21, 22, 23, 24, 25, 28, 29, 30, 31; 42, 43, 45, 46) being connected to the holding foil (17) in order to hold said conductor segments.

公开(公告)号：EP1055192A1

公开(公告)日：2000-11-29

申请号：EP99958159.8

申请日：1999-12-03

申请人： Koninklijke Philips Electronics N.V.

发明人： AFLENZER, Günter ,  SCHMALLEGGER, Peter ,  SCHOBER, Joachim ,  TOTH, Marcus

IPC分类号： G06K19/077

CPC分类号： G06K19/07747 ,  G06K19/07728 ,  G06K19/07749 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The transmission coil (11) in a device (1) which includes a data carrier module (3) with a holding means (4) and an integrated circuit (6) which is supported by the holding means (4) and includes a transmission coil (11) which is electrically conductively connected to the integrated circuit (6) and to the holding means (4), is covered, except for the area of its two coil connection contacts (13, 14), by means of a protective layer (16) of an electrically insulating material, a connection wire being provided between each coil connection contact (13, 14) and an associated circuit connection contact (7, 8), the integrated circuit (6) and the two connection wires (19, 20) and the areas of the two coil connection contacts (13, 14) which are not covered by the protective layer (16) being protectively covered by means of a single protective cap (10).