发明公开
- 专利标题: LIGHT EMITTING DIODES INCLUDING MODIFICATIONS FOR LIGHT EXTRACTION AND MANUFACTURING METHODS THEREFOR
- 专利标题(中): 经过修改的LED,以提高光提取和方法
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申请号: EP02713514.4申请日: 2002-02-01
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公开(公告)号: EP1382073A2公开(公告)日: 2004-01-21
- 发明人: SLATER, David, B., Jr. , GLASS, Robert, C. , SWOBODA, Charles, M. , KELLER, Bernd , IBBETSON, James , THIBEAULT, Brian , TARSA, Eric, J.
- 申请人: CREE, INC.
- 申请人地址: 4600 Silicon Drive Durham, NC 27703 US
- 专利权人: CREE, INC.
- 当前专利权人: CREE, INC.
- 当前专利权人地址: 4600 Silicon Drive Durham, NC 27703 US
- 代理机构: Lambrinos, Matthew Franklin
- 优先权: US265707P 20010201; US307235P 20010723
- 国际公布: WO2002061847 20020808
- 主分类号: H01L33/00
- IPC分类号: H01L33/00
摘要:
Light emitting diodes include a substrate having first and second opposing faces and that is transparent to optical radiation in a predetermined wavelength range and that is patterned to define, in cross-section, a plurality of pedestals that extend into the substrate from the first face towards the second face. A diode region on the second face is configured to emit light in the predetermined wavelength range, into the substrate upon application of voltage across the diode region. A mounting support on the diode region, opposite the substrate is configured to support the diode region, such that the light that is emitted from the diode region into the substrate, is emitted from the first face upon application of voltage across the diode region. The first face of the substrate may include therein a plurality of grooves that define the plurality of triangular pedestals in the substrate. The grooves may include tapered sidewalls and/or a beveled floor. The first face of the substrate also may include therein an array of via holes. The via holes may include tapered sidewalls and/or a floor.
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