公开(公告)号：EP2671213A1

公开(公告)日：2013-12-11

申请号：EP12701823.2

申请日：2012-01-24

申请人： Cree, Inc.

发明人： LOWES, Theodore, D. ,  TARSA, Eric, J. ,  KELLER, Bernd, P. ,  EMERSON, David, T.

IPC分类号： G09F9/33

CPC分类号： G09F9/33 ,  G09F9/3026 ,  H01L25/0753 ,  H01L33/54 ,  H01L2924/0002 ,  H01L2924/00

摘要： An LED component includes, according to a first embodiment, a monolithic substrate, an array of LED chips disposed on a surface of the substrate, and an optical lens overlying the LED chips and having a lens base attached to the substrate, where the LED chips are positioned to provide a peak emission shifted from a perpendicular centerline of the lens base. The LED component includes, according to a second embodiment, a monolithic substrate, an array of LED chips disposed on a surface of the substrate, and an array of optical lenses, each optical lens overlying at least one of the LED chips and having a lens base attached to the substrate, where at least one of the LED chips is positioned to provide a peak emission shifted from a perpendicular centerline of the respective lens base.

公开(公告)号：EP1979956A1

公开(公告)日：2008-10-15

申请号：EP07716922.5

申请日：2007-01-22

申请人： CREE, INC.

发明人： DENBAARS, Steven, P. ,  TARSA, Eric, J. ,  MACK, Michael ,  KELLER, Bernd ,  THIBEAULT, Brian ,  SAXLER, Adam, W.

IPC分类号： H01L33/00

CPC分类号： H01L33/08 ,  H01L25/0756 ,  H01L27/15 ,  H01L33/025 ,  H01L33/30 ,  H01L33/343 ,  H01L33/465 ,  H01L33/502 ,  H01L2224/8592 ,  H01L2924/0002 ,  H01S5/405 ,  H01S5/4087 ,  H01L2924/00

摘要： A solid state light emitting device comprising an emitter structure having an active region of semiconductor material and a pair of oppositely doped layers of semiconductor material on opposite sides of the active region. 'The active region emits light at a predetermined wavelength in response to an electrical bias across the doped layers. An absorption layer of semiconductor material is included that is integral to said emitter structure and doped with at least one rare earth or transition element. The absorption layer absorbs at least some of the light emitted from the active region and re-emits at least one different wavelength of light. A substrate is included with the emitter structure and absorption layer disposed on the substrate.

公开(公告)号：EP2951496A1

公开(公告)日：2015-12-09

申请号：EP14745512.5

申请日：2014-01-30

申请人： Cree, Inc.

发明人： YUAN, Zongjie ,  MA, Jiayin ,  WILCOX, Kurt, S. ,  TARSA, Eric, J.

IPC分类号： F21V7/04

摘要： A luminaire having a waveguide suspended beneath a mounting element, the waveguide has a first surface proximal to the mounting element, a second surface distal to the mounting element, and an edge between the first and the second surfaces. At least one cavity extends into the waveguide from the first surface to the second surface. A LED component is coupled to the waveguide so as to emit light into the cavity. LED support structures are also disclosed.

摘要翻译： 具有悬挂在安装元件下方的波导的照明器，波导具有靠近安装元件的第一表面，远离安装元件的第二表面以及第一和第二表面之间的边缘。 至少一个腔从第一表面延伸到第二表面。 LED组件耦合到波导以便将光发射到空腔中。 还公开了LED支撑结构。

公开(公告)号：EP2859596A2

公开(公告)日：2015-04-15

申请号：EP13730742.7

申请日：2013-06-05

申请人： Cree, Inc.

发明人： LOWES, Theodore ,  TARSA, Eric, J. ,  HEIKMAN, Sten ,  KELLER, Bernd ,  REIHERZER, Jesse ,  BENJAMIN, Hormoz

IPC分类号： H01L33/54

摘要： LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with planar surfaces that refract and/or reflect light within the package encapsulant. The packages can comprise a submount with one or more LEDs, and a blanket conversion material layer on the LEDs and the submount. The encapsulant can be on the submount, over the LEDs, and light reflected within the encapsulant will reach the conversion material, where it is absorbed and emitted omnidirectionally. Reflected light can now escape the encapsulant, allowing for efficient emission and a broader emission profile, when compared to conventional packages with hemispheric encapsulants or lenses. In certain embodiments, the LED package provides a higher chip area to LED package area ratio. By using an encapsulant with planar surfaces, the LED package can provide unique dimensional relationships between the various features and the LED package ratios, enabling more flexibility with different applications.

摘要翻译： 公开了紧凑且有效地发光的LED封装，并且可以包括具有折射和/或反射封装密封剂内的光的平坦表面的密封剂。 包装可以包括具有一个或多个LED的底座和LED和底座上的毯子转换材料层。 密封剂可以在底座上，在LED上，并且在密封剂内反射的光将到达转化材料，其中它被全向吸收和发射。 当与具有半球密封剂或透镜的常规包装相比时，反射光现在可以逃避密封剂，允许有效排放和更宽的排放曲线。 在某些实施例中，LED封装为LED封装面积比提供更高的芯片面积。 通过使用具有平面表面的密封剂，LED封装可以在各种特征和LED封装比之间提供独特的尺寸关系，从而在不同应用中实现更大的灵活性。

公开(公告)号：EP2705543A1

公开(公告)日：2014-03-12

申请号：EP12718541.1

申请日：2012-04-23

申请人： Cree, Inc.

发明人： TARSA, Eric, J. ,  LOWES, Theodore, D. ,  KELLER, Bernd, P.

IPC分类号： H01L33/20

CPC分类号： H01L33/20 ,  H01L24/32 ,  H01L2924/12041 ,  H01L2924/00

摘要： A light emitting diode (LED) for achieving an asymmetric light output includes a multilayered structure comprising a p-n junction, where at least one layer of the multilayered structure comprises a surface configured to provide a peak emission in a direction away from a normal to a mounting surface, the surface being a top or bottom surface of the layer.

公开(公告)号：EP2038939A1

公开(公告)日：2009-03-25

申请号：EP07777104.6

申请日：2007-05-16

申请人： CREE, INC.

发明人： LEUNG, Michael, S. ,  KELLER, Bernd ,  IBBETSON, James ,  TARSA, Eric, J.

IPC分类号： H01L33/00

CPC分类号： H01L33/507 ,  F21K9/60 ,  F21K9/64 ,  F21V7/0008 ,  F21V7/0033 ,  F21V7/22 ,  F21V13/04 ,  F21V29/773 ,  F21Y2115/10 ,  H01L33/60

摘要： An LED package comprises an LED for emitting LED light, and a conversion material remote to said LED for down-converting the wavelength of LED light. The package further comprises a reflector directing at least some of the LED light toward the conversion material; the conversion material down-converting the wavelength of at least some of the reflected LED light. A method for emitting light from an LED package comprising providing an LED, reflector and conversion material, and emitting light from said LED, at least some of the LED light emitted toward the reflector. The method further comprises reflecting at least some of the LED light toward the conversion material, and converting at least some of said reflected LED light at the conversion material. At least some of the converted reflected LED light is emitted by the LED package.

摘要翻译： LED为一个LED封装包括发光LED的光，并且远程于所述转换材料的LED用于降频转换的LED的光的波长。 该封装还包括反射器将至少一些所述LED的光的朝向转换材料，所述转换材料下转换中的至少一些反射LED光的波长。 一种用于从LED到LED封装发射光方法包括：提供上，反射器和转换材料，并且从LED所述发射光，至少一些朝向反射器发射的发光二极管的光。 该方法还包括反射的至少一些向所述转换材料LED光，并转换，至少一些所述的反射在转换材料的LED的光。 至少一些转化的反射LED光由LED封装发出。

公开(公告)号：EP1234139B1

公开(公告)日：2009-02-18

申请号：EP00978402.6

申请日：2000-11-08

申请人： CREE, INC.

发明人： TARSA, Eric, J. ,  THIBEAULT, Brian

IPC分类号： F21K7/00 ,  H01L33/00

CPC分类号： F21V29/74 ,  F21K9/232 ,  F21K9/61 ,  F21K9/64 ,  F21K9/68 ,  F21V7/0091 ,  F21V9/00 ,  F21V29/75 ,  F21V29/767 ,  F21Y2113/13 ,  F21Y2115/10 ,  F21Y2115/30 ,  G02B6/0008 ,  H01L33/505 ,  H01L33/58 ,  H01L33/60

摘要： A method of reducing power consumption of power amplifiers in Customer Premises Equipment (CPE) is disclosed. The power amplifier is evaluated and the Error Vector Magnitude (EVM) performance of the amplifier is modeled to obtain optimal bias voltage for the amplifier for a given modulation scheme and input signal power level. The method comprises of checking Error Vector Magnitude (EVM) for present bias and present input signal power levels of the power amplifiers, calculating optimal bias voltage for required modulation and coding scheme and biasing the power amplifier with the optimal bias voltage. The optimal bias voltage for the power amplifier can be determined either by using mathematical equations or using a look-up table.

摘要翻译： 公开了一种降低用户驻地设备（CPE）功率放大器功耗的方法。 对功率放大器进行评估，并对放大器的误差矢量幅度（EVM）性能进行建模，以便为给定的调制方案和输入信号功率电平获得放大器的最佳偏置电压。 该方法包括检查当前偏差的误差向量幅度（EVM）和功率放大器的当前输入信号功率电平，为所需调制和编码方案计算最佳偏置电压，并以最佳偏置电压偏置功率放大器。 功率放大器的最佳偏置电压可以通过使用数学方程式或使用查找表来确定。

公开(公告)号：EP2859596B1

公开(公告)日：2020-08-12

申请号：EP13730742.7

申请日：2013-06-05

申请人： Cree, Inc.

发明人： LOWES, Theodore ,  TARSA, Eric, J. ,  HEIKMAN, Sten ,  KELLER, Bernd ,  REIHERZER, Jesse ,  BENJAMIN, Hormoz

IPC分类号： H01L33/54 ,  H01L33/50

公开(公告)号：EP2304817B1

公开(公告)日：2020-01-08

申请号：EP09750906.1

申请日：2009-03-13

申请人： Cree, Inc.

发明人： YUAN, Thomas ,  KELLER, Bernd ,  IBBETSON, James ,  TARSA, Eric, J. ,  NEGLEY, Gerald

IPC分类号： H01L33/64 ,  H01L25/075 ,  H01L33/58 ,  H05B33/08

公开(公告)号：EP1234343B1

公开(公告)日：2010-11-17

申请号：EP00979221.9

申请日：2000-11-22

申请人： CREE, INC.

发明人： TARSA, Eric, J. ,  THIBEAULT, Brian ,  IBBETSON, James ,  MACK, Michael

IPC分类号： H01L33/00

CPC分类号： H01L33/38 ,  H01L33/14 ,  H01L33/20 ,  H01L33/64

摘要： An LED with improved current spreading structures that provide enhanced current injection into the LED's active layer (14), improving its power and luminous flux. The current spreading structures can be used in LEDs larger than conventional LEDs while maintaining the enhanced current injection. The invention is particularly applicable to LEDs having insulating substrates (12) but can also reduce the series resistance of LEDs having conductive substrates. The improved structures comprise conductive fingers (20a, 20b, 22) that form cooperating conductive paths that ensure that current spreads from the contacts (19, 21), into the fingers (20a, 20b, 22) and uniformly spreads through the oppositely doped layers (15, 16). The current then spreads to the active layer (14) to uniformly inject electrons and holes throughout the active layer (14), which recombine to emit light.