发明公开
- 专利标题： TAPE COMPOSITIONS FOR THE DEPOSITION OF ELECTRONIC FEATURES
- 专利标题（中）： 带状组合物存款电子结构
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申请号： EP02784156.8申请日： 2002-10-18
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公开(公告)号： EP1444055A1公开(公告)日： 2004-08-11
- 发明人: ATANASSOVA, Paolina , HAMPDEN-SMITH, Mark, J. , KODAS, Toivo, T. , VANHEUSDEN, Karel , DENHAM, Hugh , STUMP, Aaron , SCHULT, Allen , KUNZE, Klaus
- 申请人： Superior Micropowders LLC
- 申请人地址： 3740 Hawkins N.E. Albuquerque, NM 87109 US
- 专利权人： Superior Micropowders LLC
- 当前专利权人： Superior Micropowders LLC
- 当前专利权人地址： 3740 Hawkins N.E. Albuquerque, NM 87109 US
- 代理机构： Mallalieu, Catherine Louise
- 优先权： US348223P 20011019
- 国际公布： WO2003035279 20030501
- 主分类号： B05D5/12
- IPC分类号： B05D5/12 ; B32B27/00 ; B32B31/00 ; B32B31/20 ; B41M3/12 ; B44C1/165 ; H01L21/70
摘要：
Precursor compositions in the form of a tape that can be transferred to a substrate and converted to an electronic feature at a relatively low temperature, such as not greater than about 200°C. The tape composition can be disposed on a carrier to form a ribbon structure that is flexible and can be handled in a variety of industrial processes.
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