发明公开
EP1455005A3 Copper foil for high frequency circuit and method of producing of same
审中-公开
KupferfoliefürHochfrequenzschaltung und Verfahren zur deren Herstellung
- 专利标题： Copper foil for high frequency circuit and method of producing of same
- 专利标题（中）： KupferfoliefürHochfrequenzschaltung und Verfahren zur deren Herstellung
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申请号： EP04003195.7申请日： 2004-02-12
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公开(公告)号： EP1455005A3公开(公告)日： 2006-08-02
- 发明人: Shinozaki, Kensaku
- 申请人： FURUKAWA CIRCUIT FOIL CO., LTD.
- 申请人地址： 8-9, Kandanishiki-cho 1 chome, Chiyoda-ku Tokyo 101-0054 JP
- 专利权人： FURUKAWA CIRCUIT FOIL CO., LTD.
- 当前专利权人： FURUKAWA CIRCUIT FOIL CO., LTD.
- 当前专利权人地址： 8-9, Kandanishiki-cho 1 chome, Chiyoda-ku Tokyo 101-0054 JP
- 代理机构： Schmidt-Evers, Jürgen
- 优先权： JP2003033159 20030212
- 主分类号： C25D3/38
- IPC分类号： C25D3/38 ; C25D1/04 ; C25D3/12 ; C25D7/06
摘要：
An electrodeposited copper foil having a rough surface having knob-like projections and a surface roughness of 2 to 4 µm at part of a surface thereof produced by electrolysis using an electrolyte containing copper as a main component and a compound having mercapto groups, at least one type of another organic compound, and chloride ions and an electrodeposited copper foil obtained by roughening treating an untreated copper foil having a matte side, for bonding with a resin substrate, having knob-like projections and a surface roughness of 2 to 4 µm by running a predetermined current through it for a predetermined time in an electroforming bath.
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