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公开(公告)号：EP1562413A3
公开(公告)日：2008-04-02
申请号：EP05002416.5
申请日：2005-02-04
CPC分类号： C25D1/04 , C25D5/16 , C25D7/0614 , H05K3/384 , H05K2201/0355 , H05K2203/0307 , H05K2203/0723 , Y10T428/12063 , Y10T428/12438 , Y10T428/12903 , Y10T428/1291 , Y10T428/12993 , Y10T428/24917 , Y10T428/25
摘要： An object of the present invention is to provide a treated copper foil laminated with a mesomorphic polymer film having low hygroscopicity and superior high thermal resistance to make a circuit board composite materials having large peel strength and compatibility with fine pattern processes, which a copper foil being deposited with roughening particles to make the treated copper foil having a roughening treated side with surface roughness of 1.5 to 4.0 µm and luminosity of not more than 30, having projections formed from the roughening particles with a height of 1 to 5 µm, preferably 6 to 35 thereof are uniformly distributed in a 25 µm of surface length of copper foil cross-section observed, and its maximum width being at least 0.01 µm and not more than twice of 25 µm divided by the number of projections in the 25 µm surface length.
摘要翻译： 本发明的目的是提供一种具有低吸湿性和优异的高耐热性的介晶聚合物膜的经处理的铜箔，以制造具有大的剥离强度和与精细图案方法的相容性的电路板复合材料，铜箔是 沉积有粗糙粒子，使经处理的铜箔具有表面粗糙度为1.5〜4.0μm，发光度为30以下的粗糙化处理侧，具有由粗糙粒子形成的突起，高度为1〜5μm，优选为6〜 35均匀地分布在观察到的铜箔截面的25μm的表面长度中，其最大宽度为25μm以上的至少0.01μm且不大于2倍，除以25μm表面长度的突起数。
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2.发明公开Method of producing ultra-thin copper foil with carrier, ultra-thin copper foil with carrier produced by the same, printed circuit board, multilayer printed circuit board and chip on film circuit board 审中-公开一种用于与载体，以这种方式制得的载体的超薄铜箔，印刷电路板，多层印刷电路板和芯片上的薄膜电路板制造的极薄铜箔过程
公开(公告)号：EP1511366A2
公开(公告)日：2005-03-02
申请号：EP04020629.4
申请日：2004-08-31
发明人： Suzuki, Yuuji , Matsuda, Akira
CPC分类号： C25D1/04 , H01L2924/0002 , H05K3/025 , H05K3/384 , H05K2201/0355 , H05K2201/0723 , Y10T428/12028 , Y10T428/12472 , Y10T428/12493 , Y10T428/12514 , Y10T428/12535 , Y10T428/12778 , Y10T428/12806 , H01L2924/00
摘要： An object of the present invention is to produce an ultra-thin copper foil with a carrier which has few pinholes and small surface roughness and which has an the thickness of less than 5 µm, and to produce the method of producing the foil, and further to produce a printed circuit board for fine pattern, a multilayer printed circuit board and a chip on film circuit board by using the ultra-thin copper foil with a carrier. The present invention provides an ultra-thin copper foil with a carrier produced by stacking a peeling layer and an ultra thin copper foil in order on the surface of a carrier copper foil which is made smooth so that the mean surface roughness of at least one side is Rz of 0.01 to 2.0 µm by the chemical polishing, the electrochemical dissolution, or the smoothing plating processing method independently, combining two or more, or further combining the mechanical polishing.
摘要翻译： 本发明的一个目的是在超薄铜箔以产生与具有几个针孔和小的表面粗糙度，并且具有到小于5微米厚度的载体，以产生生产箔片的方法，并且进一步 通过使用超薄铜箔与载体以产生用于精细图案的印刷电路板，多层印刷电路板和芯片上的薄膜电路基板。 对本发明的超薄铜箔可以获取与通过层叠剥离层和极薄铜箔，以便产生的载体铜箔的表面上的载体的所有其由光滑所以没有在至少一侧的平均表面粗糙度 是0时01分至2.0微米的化学抛光，电化学溶解或平滑电镀处理方法unabhängig，结合两个或更多个，或另外组合机械研磨余量。
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3.发明公开Electromagnetic shielding copper foil, method of production thereof and electromagnetic shield 审中-公开电磁屏蔽铜箔，处理用于其制备方法和电磁屏蔽
公开(公告)号：EP1452627A2
公开(公告)日：2004-09-01
申请号：EP04004493.5
申请日：2004-02-27
CPC分类号： C25D5/10 , C25D3/562 , C25D3/58 , C25D5/16 , H05K1/0218 , H05K3/384 , Y10T428/12063 , Y10T428/1209 , Y10T428/12438 , Y10T428/12569 , Y10T428/12681 , Y10T428/1291 , Y10T428/12993
摘要： An electromagnetic shielding copper foil superior in electromagnetic shielding ability, high in transmittance, and free from particle shedding comprising a copper foil on at least one surface of which a fine roughening particle layer of copper or an alloy is provided and having on the fine roughening particle layer a smoothening layer comprised of cobalt, nickel, indium, or an alloy of the same and an electromagnetic shield able to be suitably used for a PDP using the same. The fine roughening particle layer may also be a layer comprised of a fine particle roughening particle layer of copper on which a fine roughening particle layer of a copper alloy is stacked or may also be formed by a copper-cobalt-nickel alloy. The smoothening layer of the copper foil may be treated for stainproof or by a silane coupling agent to protect the surface of the copper foil.
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4.发明公开Conductive base material with thin film resistance layer, method of production of conductive base material with thin film resistance layer, and circuit board with thin film resistance layer 审中-公开导电性基材与薄膜电阻层，用于制备导电性基材与薄膜电阻层，并用薄膜电阻层的印刷电路板的过程
公开(公告)号：EP1841300A1
公开(公告)日：2007-10-03
申请号：EP07006385.4
申请日：2007-03-28
IPC分类号： H05K1/16
CPC分类号： H05K1/167 , H05K2201/0355 , H05K2203/0361 , H05K2203/0723 , H05K2203/1105 , Y10T29/49082
摘要： An inexpensive conductive base material with a thin film resistance layer having small variation of the sheet resistance value and a conductive base material with a resistance layer enabling production of a printed resistor circuit board by stably leaving behind resistance elements, that is, a conductive base material with a thin film resistance layer comprised of a conductive base material having a resistance layer formed on its surface wherein the resistance layer includes Ni containing P and an amorphous and a crystalloid form are mixed together and a conductive base material with a thin film resistance layer comprised of a conductive base material having a resistance layer formed on its surface wherein the resistance layer is a crystalline thin film resistance layer including Ni containing P.
摘要翻译： 与具有薄层电阻值的偏差小，并在导电性基材带电阻层能够制造印刷电阻电路板的通过稳定地留下电阻元件的薄膜电阻层，廉价的导电性基材所做的是，在导电性基材 用包括具有形成在其表面上worin电阻层的电阻层的导电性基材的薄膜电阻层包括含Ni和非晶态和晶体形式P被混合在一起，并用薄膜电阻层的导电性基材由 具有其表面上形成worin在电阻层上的电阻层的导电性基体材料是一种结晶性薄膜电阻层，其包括含Ni P.
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5.发明公开Copper foil for fine pattern printed circuits and method of production same 有权Kupferfoliefürgedruckte Leiterplatten mit feinen Strukturen und Herstellungsverfahren
公开(公告)号：EP1448036A1
公开(公告)日：2004-08-18
申请号：EP04250762.4
申请日：2004-02-12
IPC分类号： H05K3/38
CPC分类号： H05K3/384 , C25D3/58 , C25D7/0614 , H05K3/389 , H05K2201/0355 , H05K2203/0307 , H05K2203/0723 , Y10T428/12431 , Y10T428/12438 , Y10T428/12472 , Y10T428/12903 , Y10T428/1291 , Y10T428/12993 , Y10T428/31663
摘要： Copper foil for fine pattern printed circuits having a sufficient bond strength with a resin substrate, eliminating the problems of residual copper, erosion at the bottom portions of the circuit lines, etc. at the time of formation of fine patterns, and superior in heat resistance and electrical characteristics, comprising untreated copper foil roughening treated on its surface, wherein the untreated copper foil before roughening treatment is an electrodeposited copper foil having a surface roughness in terms of 10-point average roughness Rz not more than 2.5 µm and a minimum distance between peaks of rough pyramid of at least 5 µm or having further crystal grains of an average particle size of not more than 2 µm exposed at the surface thereof, and a method of production of the same.
摘要翻译： 铜箔用于与树脂基板具有足够的粘合强度的精细图案印刷电路，消除了在形成精细图案时残留的铜，电路线底部的腐蚀等问题，并且具有优异的耐热性 和电特性，包括在其表面处理的未处理铜箔粗糙化，其中在粗糙化处理之前未处理的铜箔是具有10点平均粗糙度Rz的表面粗糙度不大于2.5μm的电沉积铜箔和最小距离 在至少5μm的粗金字塔的峰之间或在其表面暴露的平均粒径不大于2μm的另外的晶粒及其制造方法。
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公开(公告)号：EP0310401A1
公开(公告)日：1989-04-05
申请号：EP88309071.4
申请日：1988-09-29
发明人： Nakatsugawa, Hiroshi
IPC分类号： C25D5/08
CPC分类号： C25D5/08
摘要： An insoluble electrode device comprising a box (11), having an opening on one face and an outlet (12) for an electrolyte solution on at least one of other faces, mounted to said open face thereof an electrode plate (13) having apertures such as meshes, holes and pores.
According to the device of this invention, there can be formed a fresh and uniform liquid flow of an electrolyte solution in the space between the electrodes, whereby a high quality electrolytic surface treatment can be achieved.摘要翻译： 一种不溶性电极装置，包括在一个表面上具有开口的盒（11）和用于在至少一个其它表面上的电解质溶液的出口（12），所述电极板安装在所述开口面上，所述电极板（13）具有孔 作为网孔，孔和孔。 根据本发明的装置，可以在电极之间的空间中形成电解液的清新均匀的液体流动，从而可以实现高质量的电解表面处理。
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7.发明授权Copper foil for fine pattern printed circuits and method of production same 有权对于具有精细结构和制造方法的印刷电路板的铜箔
公开(公告)号：EP1448036B1
公开(公告)日：2008-04-09
申请号：EP04250762.4
申请日：2004-02-12
IPC分类号： H05K3/38
CPC分类号： H05K3/384 , C25D3/58 , C25D7/0614 , H05K3/389 , H05K2201/0355 , H05K2203/0307 , H05K2203/0723 , Y10T428/12431 , Y10T428/12438 , Y10T428/12472 , Y10T428/12903 , Y10T428/1291 , Y10T428/12993 , Y10T428/31663
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8.发明公开
公开(公告)号：EP1802183A3
公开(公告)日：2008-01-23
申请号：EP06025857.1
申请日：2006-12-13
发明人： Suzuki, Yuuji c/o Furukawa Circuit Foil Co.,Ltd. , Moteki, Takami c/o Furukawa Circuit Foil Co.,Ltd. , Hoshino, Kazuhiro c/o Furukawa Circuit Foil Co.Ltd , Fujisawa,Satoshi c/o Furukawa Circuit Foil Co.,Ltd , Kawakami, Akira c/o Furukawa Circuit Foil Co.,Ltd.
IPC分类号： H05K3/02
CPC分类号： H05K3/025 , C25D1/04 , C25D1/20 , Y10T428/12438 , Y10T428/12458 , Y10T428/12514 , Y10T428/12771 , Y10T428/12812 , Y10T428/1284 , Y10T428/12854 , Y10T428/12861 , Y10T428/1291 , Y10T428/12931
摘要： An ultrathin copper foil with a carrier not causing blistering at a release layer interface, having a low carrier peeling force, friendly to the environment, and enabling easy peeling of a carrier foil and an ultrathin copper foil even under a high temperature environment and a printed circuit board enabling a stable production quality of a base of a printed circuit board for fine pattern applications using the ultrathin copper foil with the carrier, that is, a ultrathin copper foil with a carrier comprising a carrier foil, a diffusion prevention layer, a release layer, and an ultrathin copper foil, wherein the release layer is formed by a metal A for retaining a release property and a metal B for facilitating plating of the ultrathin copper foil, a content a of the metal A and a content b of the metal B forming the release layer satisfying an equation:
and a printed circuit board prepared by using such a ultrathin copper foil with a carrier.-
9.发明公开Ultra-thin copper foil with carrier and printed wiring board using ultra-thin copper foil with carrier 审中-公开使用与载体的极薄铜箔的载体和电路板的超薄铜箔
公开(公告)号：EP1531656A3
公开(公告)日：2007-10-03
申请号：EP04026739.5
申请日：2004-11-10
发明人： Suzuki, Akitoshi , Fukuda, Shin
CPC分类号： C25D7/0614 , C25D1/04 , C25D5/48 , H05K3/025 , H05K3/383 , H05K3/384 , Y10T428/12028 , Y10T428/12438 , Y10T428/12472 , Y10T428/12493 , Y10T428/12514 , Y10T428/12569 , Y10T428/12903 , Y10T428/12993 , Y10T428/24802 , Y10T428/24917 , Y10T428/265
摘要： To produce an ultra-thin copper foil with a carrier foil that microscopic crystal grains can be deposited without being affected by the surface roughness of a carrier foil, etching can be performed until an ultrafine width such that line/space is 15 µm or less, and the microscopic line and a wiring board have large peel strength even after line of 15 µm is etched. An ultra-thin copper foil wherein a carrier foil (1), a peeling layer (2), an ultra-thin copper foil (4) are laminated in this order, the ultra-thin copper foil (4) (before roughening treatment is performed) is an electrolytic copper foil that surface roughness of 2.5 µm as ten point height of roughness profile, and the minimum distance between peaks of salients of a based material is 5 µm or more. Moreover, the surface of the ultra-thin copper foil is performed roughening treatment (5).
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10.发明公开Copper foil for high frequency circuit and method of producing of same 审中-公开KupferfoliefürHochfrequenzschaltung und Verfahren zur deren Herstellung
公开(公告)号：EP1455005A3
公开(公告)日：2006-08-02
申请号：EP04003195.7
申请日：2004-02-12
发明人： Shinozaki, Kensaku
CPC分类号： C25D11/38 , C25D1/04 , C25D3/38 , C25D5/12 , C25D5/34 , C25D5/48 , H05K3/384 , H05K2201/0355 , H05K2203/0307 , H05K2203/0723 , Y10T428/12993
摘要： An electrodeposited copper foil having a rough surface having knob-like projections and a surface roughness of 2 to 4 µm at part of a surface thereof produced by electrolysis using an electrolyte containing copper as a main component and a compound having mercapto groups, at least one type of another organic compound, and chloride ions and an electrodeposited copper foil obtained by roughening treating an untreated copper foil having a matte side, for bonding with a resin substrate, having knob-like projections and a surface roughness of 2 to 4 µm by running a predetermined current through it for a predetermined time in an electroforming bath.
摘要翻译： 一种电沉积铜箔，其具有粗糙表面，具有凸起状凸起，并且通过使用包含铜作为主要成分的电解质和具有巯基的化合物通过电解产生的表面的部分表面粗糙度为2至4μm，至少一种 类型的另一种有机化合物，以及氯化物离子和电沉积铜箔，其通过粗糙化处理未处理的具有无光泽的铜箔，与树脂基板结合，具有带凸起的凸起和表面粗糙度为2至4μm，通过运行 在电铸浴中通过其预定电流达预定时间。
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