发明公开
- 专利标题： Molded validation housing for a bill validator
- 专利标题（中）： 压铸外壳的钞票检查设备的验证
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申请号： EP04077858.1申请日： 1996-01-22
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公开(公告)号： EP1519331A3公开(公告)日： 2007-06-20
- 发明人: Bergeron, Alfred F. , Shuren, Thomas E. , Hudis, Scott
- 申请人： MEI, Inc.
- 申请人地址： 1301 Wilson Drive West Chester, PA 19380 US
- 专利权人： MEI, Inc.
- 当前专利权人： MEI, Inc.
- 当前专利权人地址： 1301 Wilson Drive West Chester, PA 19380 US
- 代理机构： Burke, Steven David
- 优先权： US376809 19950123
- 主分类号： G07F7/04
- IPC分类号： G07F7/04 ; G07D7/00 ; G07D11/00
摘要：
A bill validator is disclosed which includes a validation portion having prisms mounted on either side of a bill pathway. The prisms reflect light across the bill pathway to a photodetector to provide means for detecting foreign matter such as string in the bill pathway.
公开/授权文献
- EP1519331B1 Bill validator 公开/授权日：2012-03-28
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